{"id":"https://openalex.org/A5111361621","orcid":null,"observed_orcids":[],"display_name":"Hongbing Wan","raw_author_names":["Hongbing Wan"],"full_name":"Hongbing Wan","works_count":3,"cited_by_count":58,"summary_stats":{"2yr_mean_citedness":19.333333333333332,"h_index":2,"i10_index":2},"ids":{"openalex":"https://openalex.org/A5111361621","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I55712492","ror":"https://ror.org/02djqfd08","display_name":"Zhejiang University of Technology","country_code":"CN","type":"education","lineage":["https://openalex.org/I55712492"]},"years":[2026,2025,2024]}],"last_known_institutions":[{"id":"https://openalex.org/I55712492","ror":"https://ror.org/02djqfd08","display_name":"Zhejiang University of Technology","country_code":"CN","type":"education","lineage":["https://openalex.org/I55712492"]}],"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","count":3,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","count":2,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11451","display_name":"Advanced Machining and Optimization Techniques","count":1,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","count":1,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","value":2.35e-05,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","value":9.1e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","value":8.6e-06,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11451","display_name":"Advanced Machining and Optimization Techniques","value":7e-06,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","value":5.7e-06,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","score":0.9207620024681091},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8281000256538391},{"id":"152279782","wikidata":"https://www.wikidata.org/wiki/Q13583542","display_name":"Shearing (physics)","score":0.8013800978660583},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.6133000254631042},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.6055730581283569}],"counts_by_year":[{"year":2024,"works_count":1,"oa_works_count":0,"cited_by_count":2},{"year":2025,"works_count":1,"oa_works_count":1,"cited_by_count":37},{"year":2026,"works_count":1,"oa_works_count":1,"cited_by_count":19}],"display_name_alternatives":["Hongbing Wan"],"block_key":"h wan","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111361621","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5111361621","updated_date":"2026-11-10T14:30:39","created_date":"2024-10-11T00:00:00"}