{"id":"https://openalex.org/A5111325009","orcid":"https://orcid.org/0000-0002-0219-4414","observed_orcids":["https://orcid.org/0000-0002-0219-4414"],"display_name":"Xiaorui Lv","raw_author_names":["Xiaorui Lv"],"full_name":"Xiaorui Lv","works_count":15,"cited_by_count":87,"summary_stats":{"2yr_mean_citedness":8.333333333333334,"h_index":5,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5111325009","orcid":"https://orcid.org/0000-0002-0219-4414","observed_orcids":["https://orcid.org/0000-0002-0219-4414"]},"affiliations":[{"institution":{"id":"https://openalex.org/I115592961","ror":"https://ror.org/03jc41j30","display_name":"Jiangsu University","country_code":"CN","type":"education","lineage":["https://openalex.org/I115592961"]},"years":[2025,2024,2023,2022]},{"institution":{"id":"https://openalex.org/I200296433","ror":"https://ror.org/02drdmm93","display_name":"Chinese Academy of Medical Sciences & Peking Union Medical College","country_code":"CN","type":"education","lineage":["https://openalex.org/I200296433"]},"years":[2022]},{"institution":{"id":"https://openalex.org/I2801228662","ror":"https://ror.org/04jztag35","display_name":"Peking Union Medical College Hospital","country_code":"CN","type":"healthcare","lineage":["https://openalex.org/I2801228662"]},"years":[2022]},{"institution":{"id":"https://openalex.org/I4210089056","ror":"https://ror.org/007y7ej30","display_name":"Beijing Microelectronics Technology Institute","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089056"]},"years":[2023,2020,2017,2015,2014]}],"last_known_institutions":[{"id":"https://openalex.org/I115592961","ror":"https://ror.org/03jc41j30","display_name":"Jiangsu University","country_code":"CN","type":"education","lineage":["https://openalex.org/I115592961"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":7,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10706","display_name":"Traumatic Brain Injury and Neurovascular Disturbances","count":4,"subfield":{"id":"https://openalex.org/subfields/2728","display_name":"Clinical Neurology"},"field":{"id":"https://openalex.org/fields/27","display_name":"Medicine"},"domain":{"id":"https://openalex.org/domains/4","display_name":"Health Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":4,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10416","display_name":"Traumatic Brain Injury Research","count":3,"subfield":{"id":"https://openalex.org/subfields/2728","display_name":"Clinical Neurology"},"field":{"id":"https://openalex.org/fields/27","display_name":"Medicine"},"domain":{"id":"https://openalex.org/domains/4","display_name":"Health Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":4.73e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":3.97e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11150","display_name":"Endoplasmic Reticulum Stress and Disease","value":2.75e-05,"subfield":{"id":"https://openalex.org/subfields/1307","display_name":"Cell Biology"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","value":1.58e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","value":1.37e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.6837016344070435},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.4438447654247284},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.4365314841270447},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.3294241726398468},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.25462770462036133}],"counts_by_year":[{"year":2014,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":2015,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2020,"works_count":1,"oa_works_count":1,"cited_by_count":4},{"year":2022,"works_count":2,"oa_works_count":0,"cited_by_count":3},{"year":2023,"works_count":3,"oa_works_count":0,"cited_by_count":8},{"year":2024,"works_count":2,"oa_works_count":2,"cited_by_count":16},{"year":2025,"works_count":1,"oa_works_count":1,"cited_by_count":22},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":28}],"display_name_alternatives":["Xiaorui Lv"],"block_key":"x lv","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111325009","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}