{"id":"https://openalex.org/A5111024265","orcid":"https://orcid.org/0009-0004-8353-2535","observed_orcids":["https://orcid.org/0009-0004-8353-2535"],"display_name":"Cl\u00e9ment Sart","raw_author_names":["C. Sart","Clement Sart","Cl\u00e9ment Sart","Sart, Cl\u00e9ment"],"full_name":"Sart, Cl\u00e9ment","works_count":12,"cited_by_count":180,"summary_stats":{"2yr_mean_citedness":2.4,"h_index":5,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5111024265","orcid":"https://orcid.org/0009-0004-8353-2535","observed_orcids":["https://orcid.org/0009-0004-8353-2535"]},"affiliations":[{"institution":{"id":"https://openalex.org/I106785703","ror":"https://ror.org/05sbt2524","display_name":"Institut polytechnique de Grenoble","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},"years":[2016]},{"institution":{"id":"https://openalex.org/I1294671590","ror":"https://ror.org/02feahw73","display_name":"Centre National de la Recherche Scientifique","country_code":"FR","type":"government","lineage":["https://openalex.org/I1294671590"]},"years":[2016]},{"institution":{"id":"https://openalex.org/I177483745","ror":"https://ror.org/02aj0kh94","display_name":"Universit\u00e9 Joseph Fourier","country_code":"FR","type":"education","lineage":["https://openalex.org/I177483745","https://openalex.org/I899635006"]},"years":[2016]},{"institution":{"id":"https://openalex.org/I216852786","ror":"https://ror.org/00v0y5771","display_name":"\u00c9cole Centrale Paris","country_code":"FR","type":"education","lineage":["https://openalex.org/I216852786","https://openalex.org/I277688954","https://openalex.org/I4210107720"]},"years":[2015]},{"institution":{"id":"https://openalex.org/I4210094574","ror":"https://ror.org/00m7zca23","display_name":"Science et Ing\u00e9nierie des Mat\u00e9riaux et Proc\u00e9d\u00e9s","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210094574","https://openalex.org/I4210128300","https://openalex.org/I899635006"]},"years":[2016]},{"institution":{"id":"https://openalex.org/I4210104693","ror":"https://ror.org/01c74sd89","display_name":"STMicroelectronics (France)","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]},"years":[2026,2025,2024,2018,2016,2015]},{"institution":{"id":"https://openalex.org/I4210144798","ror":"https://ror.org/04dtfqt68","display_name":"Institut Sup\u00e9rieur de M\u00e9canique de Paris","country_code":"FR","type":"facility","lineage":["https://openalex.org/I4210144798"]},"years":[2015]},{"institution":{"id":"https://openalex.org/I4392738279","ror":"https://ror.org/05v727m31","display_name":"Communaut\u00e9 Universit\u00e9 Grenoble Alpes","country_code":"FR","type":"education","lineage":["https://openalex.org/I4392738279","https://openalex.org/I899635006"]},"years":[2019]},{"institution":{"id":"https://openalex.org/I899635006","ror":"https://ror.org/02rx3b187","display_name":"Universit\u00e9 Grenoble Alpes","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},"years":[2019,2016]}],"last_known_institutions":[{"id":"https://openalex.org/I4210104693","ror":"https://ror.org/01c74sd89","display_name":"STMicroelectronics (France)","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":7,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":7,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":6,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","count":3,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":8.15e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":5.75e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":3.9e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","value":3.38e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","value":1.77e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8406112194061279},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.5950615406036377},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.4176940321922302},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.32848885655403137},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.21281078457832336}],"counts_by_year":[{"year":2015,"works_count":1,"oa_works_count":0,"cited_by_count":6},{"year":2016,"works_count":2,"oa_works_count":0,"cited_by_count":34},{"year":2018,"works_count":2,"oa_works_count":0,"cited_by_count":125},{"year":2019,"works_count":1,"oa_works_count":1,"cited_by_count":2},{"year":2023,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2024,"works_count":1,"oa_works_count":0,"cited_by_count":9},{"year":2025,"works_count":2,"oa_works_count":0,"cited_by_count":3},{"year":2026,"works_count":2,"oa_works_count":0,"cited_by_count":0}],"display_name_alternatives":["C. Sart","Clement Sart","Cl\u00e9ment Sart","Sart, Cl\u00e9ment"],"block_key":"c sart","works_api_url":"https://api.openalex.org/works?filter=author.id:A5111024265","updated_date":"2026-10-12T12:34:37","created_date":"2025-10-10T00:00:00"}