{"id":"https://openalex.org/A5110130008","orcid":null,"observed_orcids":[],"display_name":"Shou-Yen Chao","raw_author_names":["S. Y. Chao","Shou-Yen Chao","Shouyen Chao","Shou\u2010Yen Chao"],"full_name":"Shou-Yen Chao","works_count":19,"cited_by_count":92,"summary_stats":{"2yr_mean_citedness":2.0,"h_index":5,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5110130008","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I143003336","ror":"https://ror.org/054etzm63","display_name":"Minghsin University of Science and Technology","country_code":"TW","type":"education","lineage":["https://openalex.org/I143003336"]},"years":[2024,2023,2022,2021,2018,2017,2014,2011,2010,2009]},{"institution":{"id":"https://openalex.org/I91807558","ror":"https://ror.org/01b8kcc49","display_name":"National Cheng Kung University","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]},"years":[2000,1988]}],"last_known_institutions":[{"id":"https://openalex.org/I143003336","ror":"https://ror.org/054etzm63","display_name":"Minghsin University of Science and Technology","country_code":"TW","type":"education","lineage":["https://openalex.org/I143003336"]}],"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":4,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":3,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12396","display_name":"Advanced Differential Equations and Dynamical Systems","count":3,"subfield":{"id":"https://openalex.org/subfields/2608","display_name":"Geometry and Topology"},"field":{"id":"https://openalex.org/fields/26","display_name":"Mathematics"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":3.94e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12529","display_name":"Ga2O3 and related materials","value":3.6e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12696","display_name":"Icing and De-icing Technologies","value":2.07e-05,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":1.69e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","value":1.48e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8373114466667175},{"id":"33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","score":0.5233870148658752},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.49100378155708313},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.38412603735923767},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.36755841970443726}],"counts_by_year":[{"year":1988,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2000,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2014,"works_count":1,"oa_works_count":0,"cited_by_count":2},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2017,"works_count":1,"oa_works_count":1,"cited_by_count":2},{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":3},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2021,"works_count":1,"oa_works_count":1,"cited_by_count":4},{"year":2022,"works_count":3,"oa_works_count":3,"cited_by_count":7},{"year":2023,"works_count":5,"oa_works_count":2,"cited_by_count":15},{"year":2024,"works_count":1,"oa_works_count":0,"cited_by_count":7},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":16}],"display_name_alternatives":["S. Y. Chao","Shou-Yen Chao","Shouyen Chao","Shou\u2010Yen Chao"],"block_key":"s chao","works_api_url":"https://api.openalex.org/works?filter=author.id:A5110130008","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5110130008","updated_date":"2026-11-14T11:48:19","created_date":"2016-06-24T00:00:00"}