{"id":"https://openalex.org/A5109986992","orcid":null,"observed_orcids":[],"display_name":"James D. Watts","raw_author_names":["James D. Watts"],"full_name":"James D. Watts","works_count":2,"cited_by_count":5,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":1,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5109986992","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210094473","ror":"https://ror.org/00j10x245","display_name":"Plastic Logic (United Kingdom)","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210094473"]},"years":[2012]}],"last_known_institutions":[{"id":"https://openalex.org/I4210094473","ror":"https://ror.org/00j10x245","display_name":"Plastic Logic (United Kingdom)","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210094473"]}],"topics":[{"id":"https://openalex.org/T10045","display_name":"Organic Electronics and Photovoltaics","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","count":1,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","count":1,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","value":8.3e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":5.7e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","value":5.3e-06,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","value":5e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","value":4.5e-06,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","score":0.7622108459472656},{"id":"171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","score":0.4211321473121643},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.3562992513179779},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.25839030742645264},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.23302936553955078}],"counts_by_year":[{"year":2001,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":1}],"display_name_alternatives":["James D. Watts"],"block_key":"j watts","works_api_url":"https://api.openalex.org/works?filter=author.id:A5109986992","updated_date":"2026-10-27T12:30:23","created_date":"2016-06-24T00:00:00"}