{"id":"https://openalex.org/A5109463511","orcid":null,"observed_orcids":[],"display_name":"Daniel Lu","raw_author_names":["Daniel Lu"],"full_name":"Daniel Lu","works_count":26,"cited_by_count":720,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":10,"i10_index":10},"ids":{"openalex":"https://openalex.org/A5109463511","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I130701444","ror":"https://ror.org/01zkghx44","display_name":"Georgia Institute of Technology","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]},"years":[2016]},{"institution":{"id":"https://openalex.org/I19820366","ror":"https://ror.org/034t30j35","display_name":"Chinese Academy of Sciences","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},"years":[2018,2016,2015,2014]},{"institution":{"id":"https://openalex.org/I4210111733","ror":"https://ror.org/01h0eq657","display_name":"Henkel (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210111733","https://openalex.org/I71187865"]},"years":[2010]},{"institution":{"id":"https://openalex.org/I4210145761","ror":"https://ror.org/04gh4er46","display_name":"Shenzhen Institutes of Advanced Technology","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210145761"]},"years":[2018,2016,2015,2014]}],"last_known_institutions":null,"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":18,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":7,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14454","display_name":"Polymer Science and Applications","count":6,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","count":5,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0001014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":8.24e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","value":4.74e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","value":3.3e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","value":2.93e-05,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","score":0.9380742311477661},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9230251312255859},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.8455699682235718},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.5758088231086731},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.4027020037174225}],"counts_by_year":[{"year":2008,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":10,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":40},{"year":2013,"works_count":4,"oa_works_count":0,"cited_by_count":41},{"year":2014,"works_count":1,"oa_works_count":0,"cited_by_count":24},{"year":2015,"works_count":3,"oa_works_count":1,"cited_by_count":37},{"year":2016,"works_count":4,"oa_works_count":0,"cited_by_count":66},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":62},{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":55},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":59},{"year":2020,"works_count":1,"oa_works_count":0,"cited_by_count":52},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":44},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":50},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":33},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":42},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":50},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":23}],"display_name_alternatives":["Daniel Lu"],"block_key":"d lu","works_api_url":"https://api.openalex.org/works?filter=author.id:A5109463511","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5109463511","updated_date":"2026-11-15T13:39:34","created_date":"2016-06-24T00:00:00"}