{"id":"https://openalex.org/A5109095929","orcid":null,"observed_orcids":[],"display_name":"D. L. Harmon","raw_author_names":["D Harmon","D. Harmon","D. L. Harmon","D.L. Harmon","Dave Harmon"],"full_name":"D. L. Harmon","works_count":29,"cited_by_count":1156,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":18,"i10_index":22},"ids":{"openalex":"https://openalex.org/A5109095929","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I1341412227","ror":"https://ror.org/05hh8d621","display_name":"IBM (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},"years":[2009,2008,2006,2005,2004,2003,2002,2001,2000,1990,1982]}],"last_known_institutions":[{"id":"https://openalex.org/I1341412227","ror":"https://ror.org/05hh8d621","display_name":"IBM (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":20,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":17,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","count":7,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10781","display_name":"Low-Pressure Plasma Processing and Diagnostics","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","value":0.0001831,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":0.0001679,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":7.09e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","value":5.45e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","value":4.14e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8042624592781067},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6819462776184082},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.5626968145370483},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.48135167360305786},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.3519096374511719}],"counts_by_year":[{"year":1982,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1990,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":1999,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2000,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2001,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2002,"works_count":6,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":44},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":61},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":55},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":47},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":44},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":31},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":40},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":37},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":27},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":21},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":16},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":26},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":25},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":26},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":15}],"display_name_alternatives":["D Harmon","D. Harmon","D. L. Harmon","D.L. Harmon","Dave Harmon"],"block_key":"d harmon","works_api_url":"https://api.openalex.org/works?filter=author.id:A5109095929","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}