{"id":"https://openalex.org/A5101938860","orcid":"https://orcid.org/0000-0002-1997-3078","observed_orcids":["https://orcid.org/0000-0002-1997-3078"],"display_name":"Houbao Liu","raw_author_names":["Houbao Liu"],"full_name":"Houbao Liu","works_count":23,"cited_by_count":940,"summary_stats":{"2yr_mean_citedness":6.0,"h_index":13,"i10_index":15},"ids":{"openalex":"https://openalex.org/A5101938860","orcid":"https://orcid.org/0000-0002-1997-3078","observed_orcids":["https://orcid.org/0000-0002-1997-3078"]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210147745","ror":"https://ror.org/046ft6c74","display_name":"West Anhui University","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210147745"]},"years":[2025,2024,2023]},{"institution":{"id":"https://openalex.org/I9842412","ror":"https://ror.org/01scyh794","display_name":"Nanjing University of Aeronautics and Astronautics","country_code":"CN","type":"education","lineage":["https://openalex.org/I9842412"]},"years":[2022,2021,2020,2019,2018]}],"last_known_institutions":[{"id":"https://openalex.org/I4210147745","ror":"https://ror.org/046ft6c74","display_name":"West Anhui University","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210147745"]}],"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","count":11,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11224","display_name":"Electromagnetic wave absorption materials","count":8,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10938","display_name":"Phase Change Materials Research","count":4,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14454","display_name":"Polymer Science and Applications","count":4,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11224","display_name":"Electromagnetic wave absorption materials","value":8.02e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","value":7.13e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10938","display_name":"Phase Change Materials Research","value":4.02e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12046","display_name":"MXene and MAX Phase Materials","value":3.51e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":2.82e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9421585202217102},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.8827342987060547},{"id":"97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","score":0.8029466867446899},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.10708644986152649},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.09457620978355408}],"counts_by_year":[{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2019,"works_count":1,"oa_works_count":0,"cited_by_count":3},{"year":2020,"works_count":7,"oa_works_count":1,"cited_by_count":8},{"year":2021,"works_count":6,"oa_works_count":1,"cited_by_count":65},{"year":2022,"works_count":1,"oa_works_count":0,"cited_by_count":166},{"year":2023,"works_count":1,"oa_works_count":0,"cited_by_count":165},{"year":2024,"works_count":3,"oa_works_count":1,"cited_by_count":190},{"year":2025,"works_count":3,"oa_works_count":0,"cited_by_count":204},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":138}],"display_name_alternatives":["Houbao Liu"],"block_key":"h liu","works_api_url":"https://api.openalex.org/works?filter=author.id:A5101938860","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5101938860","updated_date":"2026-11-12T13:17:38","created_date":"2018-11-09T00:00:00"}