{"id":"https://openalex.org/A5101774228","orcid":"https://orcid.org/0000-0002-2179-3885","observed_orcids":["https://orcid.org/0000-0002-2179-3885"],"display_name":"LI Yan-ping","raw_author_names":["LI Yan-ping","Li Yan-ping","Li YanPing","Li Yanping","Yan-Ping Li","Yanping Li","Yanping, Li"],"full_name":"Yanping Li","works_count":27,"cited_by_count":49,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":4,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5101774228","orcid":"https://orcid.org/0000-0002-2179-3885","observed_orcids":["https://orcid.org/0000-0002-2179-3885"]},"affiliations":[{"institution":{"id":"https://openalex.org/I161346416","ror":"https://ror.org/03hknyb50","display_name":"Jimei University","country_code":"CN","type":"education","lineage":["https://openalex.org/I161346416"]},"years":[2016,2011,2010,2009,2005]},{"institution":{"id":"https://openalex.org/I17442442","ror":"https://ror.org/05twwhs70","display_name":"State Grid Corporation of China (China)","country_code":"CN","type":"company","lineage":["https://openalex.org/I17442442"]},"years":[2024,2023]},{"institution":{"id":"https://openalex.org/I4210090857","ror":"https://ror.org/009m79n22","display_name":"Schlumberger (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210090857","https://openalex.org/I4210092184"]},"years":[2013]},{"institution":{"id":"https://openalex.org/I4210117048","ror":"https://ror.org/0394wsn58","display_name":"Harbin Electric Corporation (China)","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210117048"]},"years":[2004]},{"institution":{"id":"https://openalex.org/I4210153869","ror":"https://ror.org/0555ezg60","display_name":"Huai'an University","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210153869"]},"years":[2010]},{"institution":{"id":"https://openalex.org/I4210156189","ror":"https://ror.org/055fene14","display_name":"Shanghai Dianji University","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210156189"]},"years":[2026,2016]},{"institution":{"id":"https://openalex.org/I4405271185","ror":"https://ror.org/020z2z230","display_name":"Enbridge Inc. (Canada)","country_code":"CA","type":"company","lineage":["https://openalex.org/I4405271185"]},"years":[2018,2016]},{"institution":{"id":"https://openalex.org/I44445938","ror":"https://ror.org/01gbfax37","display_name":"Shandong Jianzhu University","country_code":"CN","type":"education","lineage":["https://openalex.org/I44445938"]},"years":[2010]}],"last_known_institutions":[{"id":"https://openalex.org/I4210156189","ror":"https://ror.org/055fene14","display_name":"Shanghai Dianji University","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210156189"]}],"topics":[{"id":"https://openalex.org/T10571","display_name":"Robotic Mechanisms and Dynamics","count":7,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","count":7,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11245","display_name":"Advanced Numerical Analysis Techniques","count":4,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12907","display_name":"Mechanical Engineering and Vibrations Research","count":4,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10719","display_name":"3D Shape Modeling and Analysis","count":3,"subfield":{"id":"https://openalex.org/subfields/1704","display_name":"Computer Graphics and Computer-Aided Design"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T12907","display_name":"Mechanical Engineering and Vibrations Research","value":5.95e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12782","display_name":"Assembly Line Balancing Optimization","value":4.98e-05,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13965","display_name":"Laser and Thermal Forming Techniques","value":4.64e-05,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10571","display_name":"Robotic Mechanisms and Dynamics","value":2.6e-05,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","value":2.16e-05,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.6910220980644226},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.5763987898826599},{"id":"33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","score":0.45616135001182556},{"id":"78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","score":0.45481833815574646},{"id":"154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","score":0.4198528230190277}],"counts_by_year":[{"year":2001,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":5,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2013,"works_count":2,"oa_works_count":0,"cited_by_count":4},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2016,"works_count":5,"oa_works_count":1,"cited_by_count":3},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2021,"works_count":1,"oa_works_count":1,"cited_by_count":6},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2023,"works_count":1,"oa_works_count":0,"cited_by_count":6},{"year":2024,"works_count":1,"oa_works_count":1,"cited_by_count":1},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2026,"works_count":1,"oa_works_count":1,"cited_by_count":4}],"display_name_alternatives":["LI Yan-ping","Li Yan-ping","Li YanPing","Li Yanping","Yan-Ping Li","Yanping Li","Yanping, Li"],"block_key":"y li","works_api_url":"https://api.openalex.org/works?filter=author.id:A5101774228","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5101774228","updated_date":"2026-11-14T11:48:19","created_date":"2016-06-24T00:00:00"}