{"id":"https://openalex.org/A5101681908","orcid":"https://orcid.org/0000-0003-1714-3422","observed_orcids":["https://orcid.org/0000-0003-1714-3422"],"display_name":"Hui Ren","raw_author_names":["Hui Ren","REN Hui"],"full_name":"Hui Ren (122548)","works_count":32,"cited_by_count":1768,"summary_stats":{"2yr_mean_citedness":30.0,"h_index":21,"i10_index":24},"ids":{"openalex":"https://openalex.org/A5101681908","orcid":"https://orcid.org/0000-0003-1714-3422","observed_orcids":["https://orcid.org/0000-0003-1714-3422"]},"affiliations":[{"institution":{"id":"https://openalex.org/I125839683","ror":"https://ror.org/01skt4w74","display_name":"Beijing Institute of Technology","country_code":"CN","type":"education","lineage":["https://openalex.org/I125839683","https://openalex.org/I890469752"]},"years":[2017,2013]},{"institution":{"id":"https://openalex.org/I194450716","ror":"https://ror.org/00js3aw79","display_name":"Jilin University","country_code":"CN","type":"education","lineage":["https://openalex.org/I194450716"]},"years":[2021,2020,2016,2006,2001,1999]},{"institution":{"id":"https://openalex.org/I4210121771","ror":"https://ror.org/02tbvhh96","display_name":"First Affiliated Hospital of Xi'an Jiaotong University","country_code":"CN","type":"healthcare","lineage":["https://openalex.org/I4210121771"]},"years":[2021,2020,2016,2015]},{"institution":{"id":"https://openalex.org/I4210142484","ror":"https://ror.org/03x6hbh34","display_name":"Second Affiliated Hospital of Jilin University","country_code":"CN","type":"healthcare","lineage":["https://openalex.org/I4210142484"]},"years":[2016]},{"institution":{"id":"https://openalex.org/I4391768272","ror":"https://ror.org/03h33sq24","display_name":"State Key Laboratory of Tribology","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4391768272","https://openalex.org/I99065089"]},"years":[2021,2020,2019,2018]},{"institution":{"id":"https://openalex.org/I58200834","ror":"https://ror.org/01vjw4z39","display_name":"Southern Medical University","country_code":"CN","type":"education","lineage":["https://openalex.org/I58200834"]},"years":[2020]},{"institution":{"id":"https://openalex.org/I74801974","ror":"https://ror.org/057zh3y96","display_name":"The University of Tokyo","country_code":"JP","type":"education","lineage":["https://openalex.org/I74801974"]},"years":[2019]},{"institution":{"id":"https://openalex.org/I76569877","ror":"https://ror.org/04ct4d772","display_name":"Southeast University","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]},"years":[2022,2021]},{"institution":{"id":"https://openalex.org/I77631543","ror":"https://ror.org/00ab95029","display_name":"Wuxi Institute of Technology","country_code":"CN","type":"education","lineage":["https://openalex.org/I77631543"]},"years":[2024]},{"institution":{"id":"https://openalex.org/I82880672","ror":"https://ror.org/00wk2mp56","display_name":"Beihang University","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]},"years":[2022]},{"institution":{"id":"https://openalex.org/I87445476","ror":"https://ror.org/017zhmm22","display_name":"Xi'an Jiaotong University","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]},"years":[2021,2020,2016,2015]},{"institution":{"id":"https://openalex.org/I99065089","ror":"https://ror.org/03cve4549","display_name":"Tsinghua University","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]},"years":[2022,2021,2020,2019,2018,2015]}],"last_known_institutions":[{"id":"https://openalex.org/I77631543","ror":"https://ror.org/00ab95029","display_name":"Wuxi Institute of Technology","country_code":"CN","type":"education","lineage":["https://openalex.org/I77631543"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":12,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":10,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","count":3,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T12850","display_name":"Field-Flow Fractionation Techniques","value":0.0001293,"subfield":{"id":"https://openalex.org/subfields/1602","display_name":"Analytical Chemistry"},"field":{"id":"https://openalex.org/fields/16","display_name":"Chemistry"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0001181,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":6.79e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","value":4.95e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11255","display_name":"Microfluidic and Bio-sensing Technologies","value":3.21e-05,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9361213445663452},{"id":"171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","score":0.5736123919487},{"id":"185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","score":0.5702105164527893},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.5639858841896057},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.26720553636550903}],"counts_by_year":[{"year":1999,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2001,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2013,"works_count":1,"oa_works_count":1,"cited_by_count":3},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2015,"works_count":2,"oa_works_count":0,"cited_by_count":9},{"year":2016,"works_count":2,"oa_works_count":1,"cited_by_count":27},{"year":2017,"works_count":2,"oa_works_count":1,"cited_by_count":55},{"year":2018,"works_count":1,"oa_works_count":1,"cited_by_count":64},{"year":2019,"works_count":5,"oa_works_count":1,"cited_by_count":61},{"year":2020,"works_count":7,"oa_works_count":1,"cited_by_count":80},{"year":2021,"works_count":6,"oa_works_count":2,"cited_by_count":151},{"year":2022,"works_count":2,"oa_works_count":1,"cited_by_count":259},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":277},{"year":2024,"works_count":1,"oa_works_count":1,"cited_by_count":269},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":265},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":181}],"display_name_alternatives":["Hui Ren","REN Hui"],"block_key":"h ren","works_api_url":"https://api.openalex.org/works?filter=author.id:A5101681908","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5101681908","updated_date":"2026-11-11T13:02:13","created_date":"2016-06-24T00:00:00"}