{"id":"https://openalex.org/A5099516367","orcid":null,"observed_orcids":[],"display_name":"Aldrin Vaquilar","raw_author_names":["Aldrin Vaquilar","VAQUILAR, ALDRIN"],"full_name":"Aldrin Vaquilar","works_count":6,"cited_by_count":13,"summary_stats":{"2yr_mean_citedness":2.6,"h_index":2,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5099516367","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210114974","ror":"https://ror.org/02kcbn207","display_name":"IMEC","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},"years":[2025,2024]}],"last_known_institutions":[{"id":"https://openalex.org/I4210114974","ror":"https://ror.org/02kcbn207","display_name":"IMEC","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","count":2,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","count":1,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":7.09e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":2.83e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","value":8.6e-06,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11803","display_name":"Superconducting and THz Device Technology","value":8.6e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","value":7.9e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","score":0.8116819858551025},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.791100025177002},{"id":"160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","score":0.7335789799690247},{"id":"98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","score":0.535280168056488},{"id":"186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","score":0.46254321932792664}],"counts_by_year":[{"year":2009,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2024,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2025,"works_count":4,"oa_works_count":2,"cited_by_count":5},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":8}],"display_name_alternatives":["Aldrin Vaquilar","VAQUILAR, ALDRIN"],"block_key":"a vaquilar","works_api_url":"https://api.openalex.org/works?filter=author.id:A5099516367","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}