{"id":"https://openalex.org/A5091817656","orcid":null,"observed_orcids":[],"display_name":"Hsun-Tien Li","raw_author_names":["Hsun-Tien Li","Hsun-tien Li","Hsun\u2010Tien Li"],"full_name":"Hsun\u2010Tien Li","works_count":17,"cited_by_count":102,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":5,"i10_index":4},"ids":{"openalex":"https://openalex.org/A5091817656","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210148468","ror":"https://ror.org/05szzwt63","display_name":"Industrial Technology Research Institute","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]},"years":[2015,2014,2012,2010,2009,2007,2006,2004,2002]},{"institution":{"id":"https://openalex.org/I72375662","ror":"https://ror.org/02znffm54","display_name":"Osaka Institute of Technology","country_code":"JP","type":"education","lineage":["https://openalex.org/I72375662"]},"years":[2004]}],"last_known_institutions":[{"id":"https://openalex.org/I4210148468","ror":"https://ror.org/05szzwt63","display_name":"Industrial Technology Research Institute","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"topics":[{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","count":9,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":8,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12420","display_name":"Silicone and Siloxane Chemistry","count":8,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12570","display_name":"Photopolymerization techniques and applications","count":5,"subfield":{"id":"https://openalex.org/subfields/1605","display_name":"Organic Chemistry"},"field":{"id":"https://openalex.org/fields/16","display_name":"Chemistry"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T12420","display_name":"Silicone and Siloxane Chemistry","value":9.72e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":7.09e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12570","display_name":"Photopolymerization techniques and applications","value":5.84e-05,"subfield":{"id":"https://openalex.org/subfields/1605","display_name":"Organic Chemistry"},"field":{"id":"https://openalex.org/fields/16","display_name":"Chemistry"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","value":5.29e-05,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":4.54e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9369508028030396},{"id":"166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","score":0.8916851282119751},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.8100599050521851},{"id":"521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","score":0.4279648959636688},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.0}],"counts_by_year":[{"year":2002,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":1,"oa_works_count":0,"cited_by_count":10},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2014,"works_count":2,"oa_works_count":0,"cited_by_count":7},{"year":2015,"works_count":4,"oa_works_count":0,"cited_by_count":13},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":3}],"display_name_alternatives":["Hsun-Tien Li","Hsun-tien Li","Hsun\u2010Tien Li"],"block_key":"h li","works_api_url":"https://api.openalex.org/works?filter=author.id:A5091817656","updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}