{"id":"https://openalex.org/A5091124209","orcid":"https://orcid.org/0000-0002-6157-9867","observed_orcids":["https://orcid.org/0000-0002-6157-9867"],"display_name":"Yuanxiang Zhang","raw_author_names":["Yuanxiang Zhang"],"full_name":"Yuanxiang Zhang","works_count":11,"cited_by_count":86,"summary_stats":{"2yr_mean_citedness":5.714285714285714,"h_index":4,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5091124209","orcid":"https://orcid.org/0000-0002-6157-9867","observed_orcids":["https://orcid.org/0000-0002-6157-9867"]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210123686","ror":"https://ror.org/024nfx323","display_name":"Quzhou University","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210123686"]},"years":[2026,2025,2024,2023,2022,2018]},{"institution":{"id":"https://openalex.org/I9224756","ror":"https://ror.org/03awzbc87","display_name":"Northeastern University","country_code":"CN","type":"education","lineage":["https://openalex.org/I9224756"]},"years":[2025]}],"last_known_institutions":[{"id":"https://openalex.org/I4210123686","ror":"https://ror.org/024nfx323","display_name":"Quzhou University","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210123686"]}],"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","count":3,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":3,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":3,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10592","display_name":"Fusion materials and technologies","count":2,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11608","display_name":"Dielectric materials and actuators","count":2,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":2.96e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","value":1.88e-05,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11646","display_name":"Nonlocal and gradient elasticity in micro/nano structures","value":1.83e-05,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":1.69e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":1.18e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9351999759674072},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.6272814273834229},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.6264320015907288},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.26260000467300415},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.22051483392715454}],"counts_by_year":[{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2022,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2023,"works_count":2,"oa_works_count":1,"cited_by_count":5},{"year":2024,"works_count":2,"oa_works_count":2,"cited_by_count":16},{"year":2025,"works_count":4,"oa_works_count":2,"cited_by_count":27},{"year":2026,"works_count":1,"oa_works_count":1,"cited_by_count":36}],"display_name_alternatives":["Yuanxiang Zhang"],"block_key":"y zhang","works_api_url":"https://api.openalex.org/works?filter=author.id:A5091124209","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5091124209","updated_date":"2026-11-13T15:08:24","created_date":"2018-12-22T00:00:00"}