{"id":"https://openalex.org/A5090364702","orcid":"https://orcid.org/0000-0001-6042-5957","observed_orcids":["https://orcid.org/0000-0001-6042-5957"],"display_name":"Xi Niu","raw_author_names":["Xi Niu"],"full_name":"Xi Xi Niu","works_count":9,"cited_by_count":54,"summary_stats":{"2yr_mean_citedness":0.5,"h_index":3,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5090364702","orcid":"https://orcid.org/0000-0001-6042-5957","observed_orcids":["https://orcid.org/0000-0001-6042-5957"]},"affiliations":[{"institution":{"id":"https://openalex.org/I4405279936","ror":"https://ror.org/026ss1989","display_name":"Chongqing Vocational College of Public Transportation","country_code":"CN","type":"education","lineage":["https://openalex.org/I4405279936"]},"years":[2025,2024,2017]},{"institution":{"id":"https://openalex.org/I91807558","ror":"https://ror.org/01b8kcc49","display_name":"National Cheng Kung University","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]},"years":[2017,2016,2015]}],"last_known_institutions":[{"id":"https://openalex.org/I4405279936","ror":"https://ror.org/026ss1989","display_name":"Chongqing Vocational College of Public Transportation","country_code":"CN","type":"education","lineage":["https://openalex.org/I4405279936"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","count":6,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","count":5,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10648","display_name":"Virtual Reality Applications and Impacts","count":1,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":3.4e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","value":2.22e-05,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","value":2.03e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","value":1.59e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13615","display_name":"Transportation Systems and Safety","value":1.29e-05,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8416516184806824},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.7600516080856323},{"id":"2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","score":0.5760778784751892},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.3597504496574402},{"id":"127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","score":0.07565316557884216}],"counts_by_year":[{"year":2015,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2016,"works_count":2,"oa_works_count":0,"cited_by_count":3},{"year":2017,"works_count":2,"oa_works_count":0,"cited_by_count":6},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":16},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2024,"works_count":2,"oa_works_count":1,"cited_by_count":1},{"year":2025,"works_count":2,"oa_works_count":1,"cited_by_count":5},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":2}],"display_name_alternatives":["Xi Niu"],"block_key":"x niu","works_api_url":"https://api.openalex.org/works?filter=author.id:A5090364702","awards_count":0,"updated_date":"2026-10-27T12:30:23","created_date":"2016-06-24T00:00:00"}