{"id":"https://openalex.org/A5087435159","orcid":null,"observed_orcids":[],"display_name":"Kari Schj\u00f8lberg\u2010Henriksen","raw_author_names":["K Schj lberg-Henriksen","K Schj\u00f8lberg-Henriksen","K. Schjlberg-Henriksen","K. Schjolberg-Henriksen","K. Schj\u00f8lberg-Henriksen","Kari Schjolberg-Henriksen","Kari Schjo\u0338lberg-Henriksen","Kari Schj\u00f8Lberg-Henriksen","Kari Schj\u00f8lberg-Henriksen","Kari Schj\u00f8lberg\u2010Henriksen","Schj\u00f8lberg-Henriksen, Kari"],"full_name":"Kari Schj\u00f8lberg\u2010Henriksen","works_count":64,"cited_by_count":608,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":14,"i10_index":16},"ids":{"openalex":"https://openalex.org/A5087435159","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I173888879","ror":"https://ror.org/01f677e56","display_name":"SINTEF","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879"]},"years":[2018,2017,2016,2015,2014,2013,2012,2010,2009,2008,2007,2006,2005,2004,2003,2000,1998]},{"institution":{"id":"https://openalex.org/I184942183","ror":"https://ror.org/01xtthb56","display_name":"University of Oslo","country_code":"NO","type":"education","lineage":["https://openalex.org/I184942183"]},"years":[2017,2003,2002]},{"institution":{"id":"https://openalex.org/I4387930215","ror":"https://ror.org/028m52w57","display_name":"SINTEF Digital","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879","https://openalex.org/I4387930215"]},"years":[2018]}],"last_known_institutions":[{"id":"https://openalex.org/I173888879","ror":"https://ror.org/01f677e56","display_name":"SINTEF","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879"]},{"id":"https://openalex.org/I4387930215","ror":"https://ror.org/028m52w57","display_name":"SINTEF Digital","country_code":"NO","type":"facility","lineage":["https://openalex.org/I173888879","https://openalex.org/I4387930215"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":52,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","count":44,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":32,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":13,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","count":5,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0006147,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","value":0.0001985,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0001814,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":5.22e-05,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":4.94e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9266486167907715},{"id":"160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","score":0.8333625793457031},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.764592707157135},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6390786170959473},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.47530001401901245}],"counts_by_year":[{"year":1998,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2000,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2002,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":3,"oa_works_count":1,"cited_by_count":0},{"year":2007,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":5,"oa_works_count":1,"cited_by_count":0},{"year":2010,"works_count":6,"oa_works_count":3,"cited_by_count":0},{"year":2012,"works_count":5,"oa_works_count":0,"cited_by_count":21},{"year":2013,"works_count":1,"oa_works_count":0,"cited_by_count":24},{"year":2014,"works_count":13,"oa_works_count":6,"cited_by_count":26},{"year":2015,"works_count":5,"oa_works_count":5,"cited_by_count":45},{"year":2016,"works_count":3,"oa_works_count":1,"cited_by_count":44},{"year":2017,"works_count":5,"oa_works_count":4,"cited_by_count":55},{"year":2018,"works_count":3,"oa_works_count":2,"cited_by_count":38},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":37},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":33},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":20},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":31},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":31},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":24},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":32},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":25}],"display_name_alternatives":["K Schj lberg-Henriksen","K Schj\u00f8lberg-Henriksen","K. Schjlberg-Henriksen","K. Schjolberg-Henriksen","K. Schj\u00f8lberg-Henriksen","Kari Schjolberg-Henriksen","Kari Schjo\u0338lberg-Henriksen","Kari Schj\u00f8Lberg-Henriksen","Kari Schj\u00f8lberg-Henriksen","Kari Schj\u00f8lberg\u2010Henriksen","Schj\u00f8lberg-Henriksen, Kari"],"block_key":"k schjolberg-henriksen","works_api_url":"https://api.openalex.org/works?filter=author.id:A5087435159","updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}