{"id":"https://openalex.org/A5087023402","orcid":"https://orcid.org/0000-0002-6740-6916","observed_orcids":["https://orcid.org/0000-0002-6740-6916"],"display_name":"Yongzhen Luo","raw_author_names":["Yongzhen Luo"],"full_name":"Yongzhen Luo","works_count":11,"cited_by_count":7,"summary_stats":{"2yr_mean_citedness":0.2857142857142857,"h_index":2,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5087023402","orcid":"https://orcid.org/0000-0002-6740-6916","observed_orcids":["https://orcid.org/0000-0002-6740-6916"]},"affiliations":[{"institution":{"id":"https://openalex.org/I139024713","ror":"https://ror.org/04azbjn80","display_name":"Guangdong University of Technology","country_code":"CN","type":"education","lineage":["https://openalex.org/I139024713"]},"years":[2025]},{"institution":{"id":"https://openalex.org/I157773358","ror":"https://ror.org/0064kty71","display_name":"Sun Yat-sen University","country_code":"CN","type":"education","lineage":["https://openalex.org/I157773358"]},"years":[2023,2022,2018]},{"institution":{"id":"https://openalex.org/I4210113818","ror":"https://ror.org/01f4k3b46","display_name":"China Electronic Product Reliability and Environmental Test Institute","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210113818"]},"years":[2025,2024]},{"institution":{"id":"https://openalex.org/I76569877","ror":"https://ror.org/04ct4d772","display_name":"Southeast University","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]},"years":[2025]}],"last_known_institutions":null,"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","count":4,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11424","display_name":"Security and Verification in Computing","count":2,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","value":3.14e-05,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13295","display_name":"Safety Systems Engineering in Autonomy","value":2.43e-05,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","value":2.34e-05,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":2.33e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","value":1.77e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.8654000163078308},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8158199787139893},{"id":"24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","score":0.476707398891449},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.3619000017642975},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.3197999894618988}],"counts_by_year":[{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2022,"works_count":2,"oa_works_count":2,"cited_by_count":3},{"year":2023,"works_count":1,"oa_works_count":1,"cited_by_count":2},{"year":2024,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2025,"works_count":5,"oa_works_count":1,"cited_by_count":2},{"year":2026,"works_count":1,"oa_works_count":0,"cited_by_count":0}],"display_name_alternatives":["Yongzhen Luo"],"block_key":"y luo","works_api_url":"https://api.openalex.org/works?filter=author.id:A5087023402","updated_date":"2026-10-12T12:34:37","created_date":"2022-11-29T00:00:00"}