{"id":"https://openalex.org/A5086801546","orcid":"https://orcid.org/0000-0002-5194-4082","observed_orcids":["https://orcid.org/0000-0002-5194-4082"],"display_name":"D.J. Pedder","raw_author_names":["D J Pedder","D J. Pedder","D. J. Pedder","D. Pedder","D.J. Pedder","David J. Pedder","David\u00a0J. Pedder"],"full_name":"David\u00a0J. Pedder","works_count":54,"cited_by_count":646,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":14,"i10_index":19},"ids":{"openalex":"https://openalex.org/A5086801546","orcid":"https://orcid.org/0000-0002-5194-4082","observed_orcids":["https://orcid.org/0000-0002-5194-4082"]},"affiliations":[{"institution":{"id":"https://openalex.org/I165779595","ror":"https://ror.org/01ej9dk98","display_name":"The University of Melbourne","country_code":"AU","type":"education","lineage":["https://openalex.org/I165779595"]},"years":[2021]},{"institution":{"id":"https://openalex.org/I4387155454","ror":"https://ror.org/05fx1fs38","display_name":"Astex Pharmaceuticals","country_code":"US","type":"company","lineage":["https://openalex.org/I114030911","https://openalex.org/I4387155454"]},"years":[1977]},{"institution":{"id":"https://openalex.org/I4388891765","ror":"https://ror.org/03y8ggs73","display_name":"Marconi Electronic Systems (United Kingdom)","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210143731","https://openalex.org/I4388891765"]},"years":[2002]},{"institution":{"id":"https://openalex.org/I4388891827","ror":"https://ror.org/017kjzz63","display_name":"GEC (United Kingdom)","country_code":"GB","type":"company","lineage":["https://openalex.org/I1306339040","https://openalex.org/I4388891827"]},"years":[2003,2002,1998,1992]},{"institution":{"id":"https://openalex.org/I86695891","ror":"https://ror.org/04cxm4j25","display_name":"Australian Catholic University","country_code":"AU","type":"education","lineage":["https://openalex.org/I86695891"]},"years":[2019,2015,2013]}],"last_known_institutions":null,"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":20,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":15,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","count":9,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","count":8,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10107","display_name":"Ferroelectric and Piezoelectric Materials","count":6,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0001767,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0001128,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12371","display_name":"Electrical Contact Performance and Analysis","value":7.79e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","value":7.1e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","value":4.08e-05,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8674043416976929},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.6983392834663391},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.6503902673721313},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6395395398139954},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.5069215893745422}],"counts_by_year":[{"year":1976,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":1977,"works_count":3,"oa_works_count":2,"cited_by_count":0},{"year":1978,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1980,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1981,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1982,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1983,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1984,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1985,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1986,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1988,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":1989,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":1990,"works_count":6,"oa_works_count":0,"cited_by_count":0},{"year":1991,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1992,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1998,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1999,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2002,"works_count":7,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2013,"works_count":1,"oa_works_count":0,"cited_by_count":3},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2015,"works_count":2,"oa_works_count":1,"cited_by_count":13},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":22},{"year":2019,"works_count":1,"oa_works_count":0,"cited_by_count":16},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":21},{"year":2021,"works_count":2,"oa_works_count":0,"cited_by_count":25},{"year":2022,"works_count":1,"oa_works_count":0,"cited_by_count":13},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":23},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":40},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":20},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":24}],"display_name_alternatives":["D J Pedder","D J. Pedder","D. J. Pedder","D. Pedder","D.J. Pedder","David J. Pedder","David\u00a0J. Pedder"],"block_key":"d pedder","works_api_url":"https://api.openalex.org/works?filter=author.id:A5086801546","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5086801546","updated_date":"2026-11-12T13:17:38","created_date":"2016-06-24T00:00:00"}