{"id":"https://openalex.org/A5084124198","orcid":null,"observed_orcids":[],"display_name":"Gerald Mittendorfer","raw_author_names":["G. Mittendorfer","Gerald Mittendorfer"],"full_name":"Gerald Mittendorfer","works_count":32,"cited_by_count":220,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":7,"i10_index":4},"ids":{"openalex":"https://openalex.org/A5084124198","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210097128","ror":"https://ror.org/00zh9em21","display_name":"Centro de Estudos da Voz","country_code":"BR","type":"other","lineage":["https://openalex.org/I4210097128"]},"years":[2013]},{"institution":{"id":"https://openalex.org/I4210121671","ror":"https://ror.org/02e8b3g15","display_name":"EV Group (Austria)","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210121671"]},"years":[2013,2012,2011,2010,2008,2007,2006,2003,2002]}],"last_known_institutions":[{"id":"https://openalex.org/I4210097128","ror":"https://ror.org/00zh9em21","display_name":"Centro de Estudos da Voz","country_code":"BR","type":"other","lineage":["https://openalex.org/I4210097128"]},{"id":"https://openalex.org/I4210121671","ror":"https://ror.org/02e8b3g15","display_name":"EV Group (Austria)","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210121671"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":30,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":20,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","count":15,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":14,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","count":3,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0003545,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0001134,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","value":6.76e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","value":3.46e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","value":2.9e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","score":0.9143485426902771},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8888702392578125},{"id":"2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","score":0.8583256006240845},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.7479733228683472},{"id":"171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","score":0.47741925716400146}],"counts_by_year":[{"year":2002,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":5,"oa_works_count":4,"cited_by_count":0},{"year":2007,"works_count":6,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":4,"oa_works_count":3,"cited_by_count":0},{"year":2010,"works_count":5,"oa_works_count":3,"cited_by_count":0},{"year":2011,"works_count":3,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":4,"oa_works_count":1,"cited_by_count":11},{"year":2013,"works_count":2,"oa_works_count":1,"cited_by_count":9},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":19},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":15},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":15},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":6}],"display_name_alternatives":["G. Mittendorfer","Gerald Mittendorfer"],"block_key":"g mittendorfer","works_api_url":"https://api.openalex.org/works?filter=author.id:A5084124198","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}