{"id":"https://openalex.org/A5082043749","orcid":null,"observed_orcids":[],"display_name":"Claude Ortolland","raw_author_names":["C. Ortolland","Claude Ortolland","ORTOLLAND, Claude","Ortolland, C."],"full_name":"Claude Ortolland","works_count":52,"cited_by_count":727,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":14,"i10_index":23},"ids":{"openalex":"https://openalex.org/A5082043749","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I1294671590","ror":"https://ror.org/02feahw73","display_name":"Centre National de la Recherche Scientifique","country_code":"FR","type":"government","lineage":["https://openalex.org/I1294671590"]},"years":[2003]},{"institution":{"id":"https://openalex.org/I1341412227","ror":"https://ror.org/05hh8d621","display_name":"IBM (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},"years":[2015,2013,2012,2011]},{"institution":{"id":"https://openalex.org/I193427800","ror":"https://ror.org/04h1q4c89","display_name":"Applied Materials (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I193427800"]},"years":[2008]},{"institution":{"id":"https://openalex.org/I35662394","ror":"https://ror.org/02h0ps145","display_name":"GlobalFoundries (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]},"years":[2018,2016,2015]},{"institution":{"id":"https://openalex.org/I4210114974","ror":"https://ror.org/02kcbn207","display_name":"IMEC","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},"years":[2011,2010,2009,2008,2006]},{"institution":{"id":"https://openalex.org/I4210122849","ror":"https://ror.org/02p2bgp27","display_name":"Philips (Netherlands)","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210122849"]},"years":[2004]},{"institution":{"id":"https://openalex.org/I4210165709","ror":"https://ror.org/05jz46060","display_name":"Philips (France)","country_code":"FR","type":"company","lineage":["https://openalex.org/I4210122849","https://openalex.org/I4210165709"]},"years":[2007,2006,2005,2004]},{"institution":{"id":"https://openalex.org/I99464096","ror":"https://ror.org/05f950310","display_name":"KU Leuven","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]},"years":[2008]}],"last_known_institutions":[{"id":"https://openalex.org/I35662394","ror":"https://ror.org/02h0ps145","display_name":"GlobalFoundries (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":48,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","count":44,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","count":26,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","count":17,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":5,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","value":0.0001631,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","value":9.95e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","value":5.98e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","value":5.26e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":4.94e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8718233108520508},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6754575371742249},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.5322546362876892},{"id":"165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","score":0.4490261971950531},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.3017493486404419}],"counts_by_year":[{"year":2003,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":7,"oa_works_count":2,"cited_by_count":0},{"year":2007,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":6,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":8,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":10,"oa_works_count":1,"cited_by_count":0},{"year":2011,"works_count":4,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":2,"oa_works_count":0,"cited_by_count":66},{"year":2013,"works_count":1,"oa_works_count":0,"cited_by_count":67},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":72},{"year":2015,"works_count":1,"oa_works_count":0,"cited_by_count":64},{"year":2016,"works_count":1,"oa_works_count":1,"cited_by_count":48},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":33},{"year":2018,"works_count":2,"oa_works_count":0,"cited_by_count":48},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":31},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":22},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":17},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":16},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":15},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":15},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":11}],"display_name_alternatives":["C. Ortolland","Claude Ortolland","ORTOLLAND, Claude","Ortolland, C."],"block_key":"c ortolland","works_api_url":"https://api.openalex.org/works?filter=author.id:A5082043749","updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}