{"id":"https://openalex.org/A5080922772","orcid":null,"observed_orcids":[],"display_name":"Minghong Jian","raw_author_names":["Minghong Jian"],"full_name":"Minghong Jian","works_count":14,"cited_by_count":162,"summary_stats":{"2yr_mean_citedness":1.0,"h_index":8,"i10_index":6},"ids":{"openalex":"https://openalex.org/A5080922772","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210127875","ror":"https://ror.org/03jdj4y14","display_name":"Nvidia (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]},"years":[2024,2023]},{"institution":{"id":"https://openalex.org/I82497590","ror":"https://ror.org/02v80fc35","display_name":"Auburn University","country_code":"US","type":"education","lineage":["https://openalex.org/I82497590"]},"years":[2023,2021,2020,2019,2018]}],"last_known_institutions":[{"id":"https://openalex.org/I4210127875","ror":"https://ror.org/03jdj4y14","display_name":"Nvidia (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127875"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":14,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","count":12,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","count":6,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":5,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","count":4,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":7.89e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","value":2.65e-05,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","value":1.71e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","value":1.42e-05,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","value":1.08e-05,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","score":0.9190999865531921},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8702387809753418},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.5674993991851807},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.5636817216873169},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.06863993406295776}],"counts_by_year":[{"year":2018,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2019,"works_count":2,"oa_works_count":0,"cited_by_count":11},{"year":2020,"works_count":3,"oa_works_count":0,"cited_by_count":12},{"year":2021,"works_count":3,"oa_works_count":0,"cited_by_count":9},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":35},{"year":2023,"works_count":3,"oa_works_count":1,"cited_by_count":31},{"year":2024,"works_count":1,"oa_works_count":0,"cited_by_count":29},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":28},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":7}],"display_name_alternatives":["Minghong Jian"],"block_key":"m jian","works_api_url":"https://api.openalex.org/works?filter=author.id:A5080922772","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5080922772","updated_date":"2026-11-10T14:30:39","created_date":"2018-08-22T00:00:00"}