{"id":"https://openalex.org/A5075845702","orcid":null,"observed_orcids":[],"display_name":"C. V\u00e9rove","raw_author_names":["C Verove","C. Verove","C. V\u00e9rove","Christophe Verove","Christophe V\u00e9rove","Verove, C.","V\u00e9rove, C.","V\u00e9rove, Christophe"],"full_name":"V\u00e9rove, Christophe","works_count":43,"cited_by_count":275,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":9,"i10_index":8},"ids":{"openalex":"https://openalex.org/A5075845702","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210104693","ror":"https://ror.org/01c74sd89","display_name":"STMicroelectronics (France)","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]},"years":[2013,2012,2011,2010,2009,2006,2005,2002,2001]},{"institution":{"id":"https://openalex.org/I48430043","ror":"https://ror.org/050jn9y42","display_name":"Institut National des Sciences Appliqu\u00e9es de Lyon","country_code":"FR","type":"education","lineage":["https://openalex.org/I203339264","https://openalex.org/I48430043"]},"years":[1999]}],"last_known_institutions":[{"id":"https://openalex.org/I4210104693","ror":"https://ror.org/01c74sd89","display_name":"STMicroelectronics (France)","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":30,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10781","display_name":"Low-Pressure Plasma Processing and Diagnostics","count":29,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","count":27,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":15,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":10,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":0.0002962,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","value":0.0002499,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0001182,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","value":4.25e-05,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","value":3.11e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.7875204086303711},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.5864393711090088},{"id":"171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","score":0.4888255000114441},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.4037339985370636},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.3695876896381378}],"counts_by_year":[{"year":1998,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1999,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2001,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2002,"works_count":5,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":8,"oa_works_count":1,"cited_by_count":0},{"year":2011,"works_count":11,"oa_works_count":3,"cited_by_count":0},{"year":2012,"works_count":7,"oa_works_count":1,"cited_by_count":9},{"year":2013,"works_count":1,"oa_works_count":0,"cited_by_count":27},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":22},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":23},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":32},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":16},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":18},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":19},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":12}],"display_name_alternatives":["C Verove","C. Verove","C. V\u00e9rove","Christophe Verove","Christophe V\u00e9rove","Verove, C.","V\u00e9rove, C.","V\u00e9rove, Christophe"],"block_key":"c verove","works_api_url":"https://api.openalex.org/works?filter=author.id:A5075845702","awards_count":0,"updated_date":"2026-11-08T12:57:04","created_date":"2016-06-24T00:00:00"}