{"id":"https://openalex.org/A5070570954","orcid":"https://orcid.org/0009-0007-9499-9108","observed_orcids":["https://orcid.org/0009-0007-9499-9108"],"display_name":"Jens Bonitz","raw_author_names":["Bonitz Jens","Bonitz, J.","Bonitz, Jens","J Bonitz","J. Bonitz","Jens Bonitz"],"full_name":"Bonitz, Jens","works_count":38,"cited_by_count":88,"summary_stats":{"2yr_mean_citedness":0.3333333333333333,"h_index":5,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5070570954","orcid":"https://orcid.org/0009-0007-9499-9108","observed_orcids":["https://orcid.org/0009-0007-9499-9108"]},"affiliations":[{"institution":{"id":"https://openalex.org/I2610724","ror":"https://ror.org/00a208s56","display_name":"Chemnitz University of Technology","country_code":"DE","type":"education","lineage":["https://openalex.org/I2610724"]},"years":[2017,2016,2015,2009,2007,2005,2004,2003]},{"institution":{"id":"https://openalex.org/I4210107253","ror":"https://ror.org/01v66s741","display_name":"3D-Micromac (Germany)","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210107253"]},"years":[2007]},{"institution":{"id":"https://openalex.org/I4210120526","ror":"https://ror.org/02h12bg79","display_name":"Fraunhofer Institute for Electronic Nano Systems","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210120526","https://openalex.org/I4923324"]},"years":[2025,2024,2023,2012]}],"last_known_institutions":[{"id":"https://openalex.org/I4210120526","ror":"https://ror.org/02h12bg79","display_name":"Fraunhofer Institute for Electronic Nano Systems","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210120526","https://openalex.org/I4923324"]}],"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","count":21,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10074","display_name":"Carbon Nanotubes in Composites","count":15,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","count":9,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","value":9.13e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10074","display_name":"Carbon Nanotubes in Composites","value":8.25e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":4.75e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":4.59e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","value":4.5e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8375474214553833},{"id":"171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","score":0.7069581747055054},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.5234450697898865},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.5160183906555176},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.48270320892333984}],"counts_by_year":[{"year":2003,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2006,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":3,"oa_works_count":1,"cited_by_count":0},{"year":2008,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":5,"oa_works_count":1,"cited_by_count":0},{"year":2010,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":1,"oa_works_count":0,"cited_by_count":5},{"year":2013,"works_count":1,"oa_works_count":0,"cited_by_count":3},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2015,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2016,"works_count":5,"oa_works_count":0,"cited_by_count":6},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":6},{"year":2018,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2020,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2023,"works_count":3,"oa_works_count":1,"cited_by_count":4},{"year":2024,"works_count":3,"oa_works_count":0,"cited_by_count":13},{"year":2025,"works_count":3,"oa_works_count":2,"cited_by_count":8},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":4}],"display_name_alternatives":["Bonitz Jens","Bonitz, J.","Bonitz, Jens","J Bonitz","J. Bonitz","Jens Bonitz"],"block_key":"j bonitz","works_api_url":"https://api.openalex.org/works?filter=author.id:A5070570954","updated_date":"2026-11-01T11:00:13","created_date":"2016-06-24T00:00:00"}