{"id":"https://openalex.org/A5066094403","orcid":null,"observed_orcids":[],"display_name":"Welch Lin","raw_author_names":["W. M. Lin","W.M. Lin","Welch Lin"],"full_name":"Welch Lin","works_count":17,"cited_by_count":122,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":4,"i10_index":4},"ids":{"openalex":"https://openalex.org/A5066094403","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210161555","ror":"https://ror.org/0580qje17","display_name":"United Microelectronics (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210161555"]},"years":[2013,2012,2011,2007,2005]},{"institution":{"id":"https://openalex.org/I77566578","ror":"https://ror.org/00vrhw316","display_name":"United Microelectronics (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210161555","https://openalex.org/I77566578"]},"years":[2010]}],"last_known_institutions":[{"id":"https://openalex.org/I4210161555","ror":"https://ror.org/0580qje17","display_name":"United Microelectronics (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210161555"]}],"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":13,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","count":10,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":9,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","count":3,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":0.0001287,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","value":7.87e-05,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":7.11e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","value":4.59e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","value":4.26e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8140585422515869},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6568276882171631},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.5102930068969727},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.4543924927711487},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.29190903902053833}],"counts_by_year":[{"year":2005,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":6,"oa_works_count":4,"cited_by_count":0},{"year":2011,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":2,"oa_works_count":0,"cited_by_count":4},{"year":2013,"works_count":3,"oa_works_count":0,"cited_by_count":8},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":16},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":17},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":5}],"display_name_alternatives":["W. M. Lin","W.M. Lin","Welch Lin"],"block_key":"w lin","works_api_url":"https://api.openalex.org/works?filter=author.id:A5066094403","awards_count":0,"updated_date":"2026-11-04T11:47:51","created_date":"2016-06-24T00:00:00"}