{"id":"https://openalex.org/A5055993156","orcid":null,"observed_orcids":[],"display_name":"Arianna Morelli","raw_author_names":["A. Morelli","Arianna Morelli"],"full_name":"Arianna Morelli","works_count":14,"cited_by_count":175,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":6,"i10_index":4},"ids":{"openalex":"https://openalex.org/A5055993156","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210154781","ror":"https://ror.org/053bqv655","display_name":"STMicroelectronics (Italy)","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]},"years":[2021,2020,2019,2018,2006,2004,2003]}],"last_known_institutions":[{"id":"https://openalex.org/I4210154781","ror":"https://ror.org/053bqv655","display_name":"STMicroelectronics (Italy)","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":12,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","count":12,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","count":9,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":2,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","count":2,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":6.8e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","value":4.22e-05,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","value":4.12e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","value":1.42e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":1.18e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","score":0.7348193526268005},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.6376224160194397},{"id":"204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","score":0.579832136631012},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.3599472939968109},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.19116470217704773}],"counts_by_year":[{"year":2003,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2018,"works_count":3,"oa_works_count":0,"cited_by_count":2},{"year":2019,"works_count":2,"oa_works_count":1,"cited_by_count":15},{"year":2020,"works_count":2,"oa_works_count":1,"cited_by_count":15},{"year":2021,"works_count":1,"oa_works_count":0,"cited_by_count":14},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":15},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":2}],"display_name_alternatives":["A. Morelli","Arianna Morelli"],"block_key":"a morelli","works_api_url":"https://api.openalex.org/works?filter=author.id:A5055993156","updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}