{"id":"https://openalex.org/A5055608232","orcid":"https://orcid.org/0000-0001-8399-4343","observed_orcids":["https://orcid.org/0000-0001-8399-4343"],"display_name":"Mazin H. Obaidat","raw_author_names":["M. Obaidat","M.H. Obaidat","Mazin H. Obaidat","Mazin Obaidat"],"full_name":"Mazin H. Obaidat","works_count":18,"cited_by_count":243,"summary_stats":{"2yr_mean_citedness":2.0,"h_index":7,"i10_index":5},"ids":{"openalex":"https://openalex.org/A5055608232","orcid":"https://orcid.org/0000-0001-8399-4343","observed_orcids":["https://orcid.org/0000-0001-8399-4343"]},"affiliations":[{"institution":{"id":"https://openalex.org/I123946342","ror":"https://ror.org/008rmbt77","display_name":"Binghamton University","country_code":"US","type":"education","lineage":["https://openalex.org/I123946342"]},"years":[2014,2013,2012]},{"institution":{"id":"https://openalex.org/I157392197","ror":"https://ror.org/04a1r5z94","display_name":"Hashemite University","country_code":"JO","type":"education","lineage":["https://openalex.org/I157392197"]},"years":[2026,2025,2024,2018,2017]}],"last_known_institutions":[{"id":"https://openalex.org/I157392197","ror":"https://ror.org/04a1r5z94","display_name":"Hashemite University","country_code":"JO","type":"education","lineage":["https://openalex.org/I157392197"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","count":4,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","count":3,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10164","display_name":"Quality and Supply Management","count":2,"subfield":{"id":"https://openalex.org/subfields/1404","display_name":"Management Information Systems"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T10438","display_name":"Energy, Environment, Economic Growth","count":2,"subfield":{"id":"https://openalex.org/subfields/2002","display_name":"Economics and Econometrics"},"field":{"id":"https://openalex.org/fields/20","display_name":"Economics, Econometrics and Finance"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":2.82e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12617","display_name":"Energy, Environment, and Transportation Policies","value":1.48e-05,"subfield":{"id":"https://openalex.org/subfields/2105","display_name":"Renewable Energy, Sustainability and the Environment"},"field":{"id":"https://openalex.org/fields/21","display_name":"Energy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12423","display_name":"Software Reliability and Analysis Research","value":1.33e-05,"subfield":{"id":"https://openalex.org/subfields/1712","display_name":"Software"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":1.18e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10438","display_name":"Energy, Environment, Economic Growth","value":1.12e-05,"subfield":{"id":"https://openalex.org/subfields/2002","display_name":"Economics and Econometrics"},"field":{"id":"https://openalex.org/fields/20","display_name":"Economics, Econometrics and Finance"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8581478595733643},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.6934000253677368},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.465537428855896},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.4555000066757202},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.198932945728302}],"counts_by_year":[{"year":2012,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2013,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2014,"works_count":1,"oa_works_count":0,"cited_by_count":3},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2017,"works_count":2,"oa_works_count":1,"cited_by_count":7},{"year":2018,"works_count":3,"oa_works_count":2,"cited_by_count":28},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":26},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":30},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":21},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":23},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":17},{"year":2024,"works_count":2,"oa_works_count":0,"cited_by_count":24},{"year":2025,"works_count":2,"oa_works_count":2,"cited_by_count":22},{"year":2026,"works_count":4,"oa_works_count":1,"cited_by_count":24}],"display_name_alternatives":["M. Obaidat","M.H. Obaidat","Mazin H. Obaidat","Mazin Obaidat"],"block_key":"m obaidat","works_api_url":"https://api.openalex.org/works?filter=author.id:A5055608232","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5055608232","updated_date":"2026-11-12T13:17:38","created_date":"2016-06-24T00:00:00"}