{"id":"https://openalex.org/A5055468588","orcid":"https://orcid.org/0000-0002-6585-5398","observed_orcids":["https://orcid.org/0000-0002-6585-5398"],"display_name":"Anass Jakani","raw_author_names":["A. Jakani","Anass Jakani","Jakani, Anass"],"full_name":"Jakani, Anass","works_count":20,"cited_by_count":52,"summary_stats":{"2yr_mean_citedness":0.7,"h_index":4,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5055468588","orcid":"https://orcid.org/0000-0002-6585-5398","observed_orcids":["https://orcid.org/0000-0002-6585-5398"]},"affiliations":[{"institution":{"id":"https://openalex.org/I1294671590","ror":"https://ror.org/02feahw73","display_name":"Centre National de la Recherche Scientifique","country_code":"FR","type":"government","lineage":["https://openalex.org/I1294671590"]},"years":[2021]},{"institution":{"id":"https://openalex.org/I4210093397","ror":"https://ror.org/00f7srh09","display_name":"XLIM","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I32881790","https://openalex.org/I4210093397","https://openalex.org/I4210095849","https://openalex.org/I65806277"]},"years":[2022,2021]},{"institution":{"id":"https://openalex.org/I4210152719","ror":"https://ror.org/0509ggw88","display_name":"III V Lab","country_code":"FR","type":"facility","lineage":["https://openalex.org/I4210152719"]},"years":[2026,2025]},{"institution":{"id":"https://openalex.org/I65806277","ror":"https://ror.org/02cp04407","display_name":"Universit\u00e9 de Limoges","country_code":"FR","type":"education","lineage":["https://openalex.org/I65806277"]},"years":[2022,2021,2020]}],"last_known_institutions":[{"id":"https://openalex.org/I4210152719","ror":"https://ror.org/0509ggw88","display_name":"III V Lab","country_code":"FR","type":"facility","lineage":["https://openalex.org/I4210152719"]}],"topics":[{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","count":18,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","count":14,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","count":6,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":3,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","value":7.74e-05,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","value":6.4e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":5.91e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","value":3.9e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","value":2.83e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.7455563545227051},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.740938663482666},{"id":"204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","score":0.6633998155593872},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.5138000249862671},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.46389999985694885}],"counts_by_year":[{"year":2020,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2021,"works_count":2,"oa_works_count":2,"cited_by_count":1},{"year":2022,"works_count":6,"oa_works_count":6,"cited_by_count":7},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2024,"works_count":1,"oa_works_count":1,"cited_by_count":12},{"year":2025,"works_count":7,"oa_works_count":2,"cited_by_count":21},{"year":2026,"works_count":2,"oa_works_count":2,"cited_by_count":6}],"display_name_alternatives":["A. Jakani","Anass Jakani","Jakani, Anass"],"block_key":"a jakani","works_api_url":"https://api.openalex.org/works?filter=author.id:A5055468588","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5055468588","updated_date":"2026-11-08T12:57:04","created_date":"2020-08-13T00:00:00"}