{"id":"https://openalex.org/A5048622945","orcid":null,"observed_orcids":[],"display_name":"Mooho Lee","raw_author_names":["Mooho Lee"],"full_name":"Mooho Lee","works_count":3,"cited_by_count":7,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":1,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5048622945","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I139264467","ror":"https://ror.org/04h9pn542","display_name":"Seoul National University","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]},"years":[2022]},{"institution":{"id":"https://openalex.org/I2250650973","ror":"https://ror.org/04w3jy968","display_name":"Samsung (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},"years":[2026,2022]},{"institution":{"id":"https://openalex.org/I4399598381","ror":"https://ror.org/04axnyp10","display_name":"Samsung Advanced Institute of Technology (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I4399598381"]},"years":[2026]},{"institution":{"id":"https://openalex.org/I4405259277","ror":"https://ror.org/020m7t761","display_name":"Samsung Electronics (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]},"years":[2026,2022]}],"last_known_institutions":[{"id":"https://openalex.org/I2250650973","ror":"https://ror.org/04w3jy968","display_name":"Samsung (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},{"id":"https://openalex.org/I4399598381","ror":"https://ror.org/04axnyp10","display_name":"Samsung Advanced Institute of Technology (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I4399598381"]},{"id":"https://openalex.org/I4405259277","ror":"https://ror.org/020m7t761","display_name":"Samsung Electronics (South Korea)","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]}],"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","count":3,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","count":2,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10474","display_name":"Material Dynamics and Properties","count":1,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10511","display_name":"High voltage insulation and dielectric phenomena","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10810","display_name":"Polymer composites and self-healing","count":1,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","value":1.95e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","value":1.18e-05,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10810","display_name":"Polymer composites and self-healing","value":1.16e-05,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10511","display_name":"High voltage insulation and dielectric phenomena","value":4.9e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10474","display_name":"Material Dynamics and Properties","value":3.5e-06,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","score":0.8883956670761108},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8824999928474426},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.7846999764442444},{"id":"97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","score":0.7662000060081482},{"id":"521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","score":0.3747999966144562}],"counts_by_year":[{"year":2022,"works_count":1,"oa_works_count":1,"cited_by_count":1},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2026,"works_count":2,"oa_works_count":2,"cited_by_count":3}],"display_name_alternatives":["Mooho Lee"],"block_key":"m lee","works_api_url":"https://api.openalex.org/works?filter=author.id:A5048622945","awards_count":0,"updated_date":"2026-10-28T12:34:19","created_date":"2022-03-05T00:00:00"}