{"id":"https://openalex.org/A5043348907","orcid":null,"observed_orcids":[],"display_name":"Zhuo Miao","raw_author_names":["Zhuo Miao"],"full_name":"Zhuo Miao","works_count":5,"cited_by_count":42,"summary_stats":{"2yr_mean_citedness":6.0,"h_index":4,"i10_index":2},"ids":{"openalex":"https://openalex.org/A5043348907","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I154099455","ror":"https://ror.org/0207yh398","display_name":"Shandong University","country_code":"CN","type":"education","lineage":["https://openalex.org/I154099455"]},"years":[2026,2025,2024,2022]},{"institution":{"id":"https://openalex.org/I4387152797","ror":"https://ror.org/02n7p8p77","display_name":"Shandong Institute of Advanced Technology","country_code":"CN","type":"education","lineage":["https://openalex.org/I4387152797"]},"years":[2025]}],"last_known_institutions":[{"id":"https://openalex.org/I154099455","ror":"https://ror.org/0207yh398","display_name":"Shandong University","country_code":"CN","type":"education","lineage":["https://openalex.org/I154099455"]}],"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","count":3,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","count":2,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12139","display_name":"Advanced Thermodynamic Systems and Engines","count":2,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10107","display_name":"Ferroelectric and Piezoelectric Materials","count":1,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10275","display_name":"2D Materials and Applications","count":1,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","value":1.95e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12139","display_name":"Advanced Thermodynamic Systems and Engines","value":1.94e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","value":1.51e-05,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13200","display_name":"Spacecraft and Cryogenic Technologies","value":1.3e-05,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":1.18e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9068343639373779},{"id":"97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","score":0.782093346118927},{"id":"97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","score":0.5734178423881531},{"id":"204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","score":0.5473999977111816},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.1471196413040161}],"counts_by_year":[{"year":2022,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2024,"works_count":1,"oa_works_count":0,"cited_by_count":5},{"year":2025,"works_count":2,"oa_works_count":1,"cited_by_count":18},{"year":2026,"works_count":1,"oa_works_count":1,"cited_by_count":17}],"display_name_alternatives":["Zhuo Miao"],"block_key":"z miao","works_api_url":"https://api.openalex.org/works?filter=author.id:A5043348907","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5043348907","updated_date":"2026-11-08T12:57:04","created_date":"2022-11-30T00:00:00"}