{"id":"https://openalex.org/A5043109490","orcid":null,"observed_orcids":[],"display_name":"Barbara Pahl","raw_author_names":["B. Pahl","Barbara Pahl","Pahl, B.","Pahl, Barbara"],"full_name":"Pahl, Barbara","works_count":36,"cited_by_count":181,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":7,"i10_index":7},"ids":{"openalex":"https://openalex.org/A5043109490","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210134425","ror":"https://ror.org/031aqk326","display_name":"Fraunhofer Institute for Reliability and Microintegration","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},"years":[2026,2022,2019,2013,2011,2009]},{"institution":{"id":"https://openalex.org/I4577782","ror":"https://ror.org/03v4gjf40","display_name":"Technische Universit\u00e4t Berlin","country_code":"DE","type":"education","lineage":["https://openalex.org/I4577782"]},"years":[2011,2008,2006,2004,2003,2002]},{"institution":{"id":"https://openalex.org/I4923324","ror":"https://ror.org/05hkkdn48","display_name":"Fraunhofer-Gesellschaft","country_code":"DE","type":"government","lineage":["https://openalex.org/I4923324"]},"years":[2026]}],"last_known_institutions":[{"id":"https://openalex.org/I4210134425","ror":"https://ror.org/031aqk326","display_name":"Fraunhofer Institute for Reliability and Microintegration","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4923324","ror":"https://ror.org/05hkkdn48","display_name":"Fraunhofer-Gesellschaft","country_code":"DE","type":"government","lineage":["https://openalex.org/I4923324"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":27,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":26,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":5,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":5,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0003073,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.000153,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":4.94e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","value":4.13e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","value":3.37e-05,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"x_concepts":[{"id":"79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","score":0.9571999907493591},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8792999982833862},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.6155999898910522},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.6039199829101562},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.4027000069618225}],"counts_by_year":[{"year":2002,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":8,"oa_works_count":2,"cited_by_count":0},{"year":2008,"works_count":7,"oa_works_count":2,"cited_by_count":0},{"year":2009,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":1,"oa_works_count":0,"cited_by_count":14},{"year":2013,"works_count":2,"oa_works_count":0,"cited_by_count":10},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2018,"works_count":2,"oa_works_count":2,"cited_by_count":3},{"year":2019,"works_count":1,"oa_works_count":1,"cited_by_count":8},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2022,"works_count":2,"oa_works_count":2,"cited_by_count":5},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2026,"works_count":4,"oa_works_count":4,"cited_by_count":7}],"display_name_alternatives":["B. Pahl","Barbara Pahl","Pahl, B.","Pahl, Barbara"],"block_key":"b pahl","works_api_url":"https://api.openalex.org/works?filter=author.id:A5043109490","updated_date":"2026-11-08T12:57:04","created_date":"2016-06-24T00:00:00"}