{"id":"https://openalex.org/A5040392273","orcid":null,"observed_orcids":[],"display_name":"Masaru Bunya","raw_author_names":["M. Bunya","Masaru BUNYA","Masaru Bunya"],"full_name":"BUNYA, Masaru","works_count":18,"cited_by_count":153,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":5,"i10_index":4},"ids":{"openalex":"https://openalex.org/A5040392273","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I201537933","ror":"https://ror.org/01dq60k83","display_name":"Tohoku University","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]},"years":[2008]},{"institution":{"id":"https://openalex.org/I4210133192","ror":"https://ror.org/03c55am86","display_name":"Nitto Boseki (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210133192"]},"years":[2017,2015,2014,2013,2012,2011]}],"last_known_institutions":[{"id":"https://openalex.org/I4210133192","ror":"https://ror.org/03c55am86","display_name":"Nitto Boseki (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210133192"]}],"topics":[{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","count":16,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":13,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":9,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10310","display_name":"Corrosion Behavior and Inhibition","count":2,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":0.0001283,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","value":8.96e-05,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":7.09e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":5.1e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11907","display_name":"Copper-based nanomaterials and applications","value":3.05e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","score":0.8060224056243896},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8057106733322144},{"id":"185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","score":0.7135059237480164},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.5289597511291504},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.4118376672267914}],"counts_by_year":[{"year":2008,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":3,"oa_works_count":3,"cited_by_count":0},{"year":2012,"works_count":5,"oa_works_count":3,"cited_by_count":10},{"year":2013,"works_count":5,"oa_works_count":2,"cited_by_count":7},{"year":2014,"works_count":2,"oa_works_count":2,"cited_by_count":14},{"year":2015,"works_count":1,"oa_works_count":1,"cited_by_count":13},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":10},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":17},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":2}],"display_name_alternatives":["M. Bunya","Masaru BUNYA","Masaru Bunya"],"block_key":"m bunya","works_api_url":"https://api.openalex.org/works?filter=author.id:A5040392273","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5040392273","updated_date":"2026-11-08T12:57:04","created_date":"2016-06-24T00:00:00"}