{"id":"https://openalex.org/A5037578599","orcid":null,"observed_orcids":[],"display_name":"Binhao Lian","raw_author_names":["B.H. Lian","Binhao Lian"],"full_name":"Binhao Lian","works_count":31,"cited_by_count":99,"summary_stats":{"2yr_mean_citedness":12.0,"h_index":6,"i10_index":4},"ids":{"openalex":"https://openalex.org/A5037578599","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210089056","ror":"https://ror.org/007y7ej30","display_name":"Beijing Microelectronics Technology Institute","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089056"]},"years":[2025,2019,2018,2017,2016,2015,2014,2013,2012,2007]},{"institution":{"id":"https://openalex.org/I4210110013","ror":"https://ror.org/01v171a61","display_name":"National Center for Women and Children\u2019s Health, China CDC","country_code":"CN","type":"government","lineage":["https://openalex.org/I184490438","https://openalex.org/I4210110013","https://openalex.org/I4210127390","https://openalex.org/I4210151987"]},"years":[2015,2014,2013]},{"institution":{"id":"https://openalex.org/I4210154323","ror":"https://ror.org/059h8x781","display_name":"China Central Television","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210154323"]},"years":[2015,2014,2013]}],"last_known_institutions":[{"id":"https://openalex.org/I4210089056","ror":"https://ror.org/007y7ej30","display_name":"Beijing Microelectronics Technology Institute","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089056"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":26,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":23,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":9,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","count":4,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","count":4,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0002718,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0001474,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","value":3.08e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","value":2.83e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","value":2.37e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","score":0.924656093120575},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.866091251373291},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.5523303151130676},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.377717524766922},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.27345749735832214}],"counts_by_year":[{"year":2007,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":1,"oa_works_count":0,"cited_by_count":2},{"year":2013,"works_count":4,"oa_works_count":0,"cited_by_count":3},{"year":2014,"works_count":10,"oa_works_count":0,"cited_by_count":3},{"year":2015,"works_count":6,"oa_works_count":0,"cited_by_count":6},{"year":2016,"works_count":3,"oa_works_count":1,"cited_by_count":4},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":3},{"year":2018,"works_count":2,"oa_works_count":0,"cited_by_count":4},{"year":2019,"works_count":1,"oa_works_count":1,"cited_by_count":7},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2025,"works_count":1,"oa_works_count":1,"cited_by_count":14},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":15}],"display_name_alternatives":["B.H. Lian","Binhao Lian"],"block_key":"b lian","works_api_url":"https://api.openalex.org/works?filter=author.id:A5037578599","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}