{"id":"https://openalex.org/A5036487496","orcid":"https://orcid.org/0009-0006-8698-3416","observed_orcids":["https://orcid.org/0009-0006-8698-3416"],"display_name":"Thomas Krivec","raw_author_names":["T. Krivec","Thomas Krivec"],"full_name":"Thomas Krivec","works_count":47,"cited_by_count":301,"summary_stats":{"2yr_mean_citedness":1.25,"h_index":9,"i10_index":8},"ids":{"openalex":"https://openalex.org/A5036487496","orcid":"https://orcid.org/0009-0006-8698-3416","observed_orcids":["https://orcid.org/0009-0006-8698-3416"]},"affiliations":[{"institution":{"id":"https://openalex.org/I182712176","ror":"https://ror.org/02fhfw393","display_name":"Montanuniversit\u00e4t Leoben","country_code":"AT","type":"education","lineage":["https://openalex.org/I182712176"]},"years":[2022,2002]},{"institution":{"id":"https://openalex.org/I4210126372","ror":"https://ror.org/0307rp314","display_name":"AT&S (Austria)","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210126372"]},"years":[2026,2025,2024,2023,2022,2021,2020,2019,2017,2016,2015,2014,2013]},{"institution":{"id":"https://openalex.org/I4210131237","ror":"https://ror.org/02j8sxk20","display_name":"Polymer Competence Center Leoben (Austria)","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210131237"]},"years":[2023]},{"institution":{"id":"https://openalex.org/I4210132789","ror":"https://ror.org/03q1xez23","display_name":"AustriaTech (Austria)","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210132789"]},"years":[2026]}],"last_known_institutions":[{"id":"https://openalex.org/I4210126372","ror":"https://ror.org/0307rp314","display_name":"AT&S (Austria)","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210126372"]},{"id":"https://openalex.org/I4210132789","ror":"https://ror.org/03q1xez23","display_name":"AustriaTech (Austria)","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210132789"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":28,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","count":10,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13312","display_name":"Mechanical and Thermal Properties Analysis","count":10,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","count":6,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":5,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0001587,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13312","display_name":"Mechanical and Thermal Properties Analysis","value":0.000118,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":5.91e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","value":3.53e-05,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12570","display_name":"Photopolymerization techniques and applications","value":3.51e-05,"subfield":{"id":"https://openalex.org/subfields/1605","display_name":"Organic Chemistry"},"field":{"id":"https://openalex.org/fields/16","display_name":"Chemistry"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9100128412246704},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.7732904553413391},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.6912753582000732},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.4690999984741211},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.22630539536476135}],"counts_by_year":[{"year":2002,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2013,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2014,"works_count":3,"oa_works_count":0,"cited_by_count":9},{"year":2015,"works_count":2,"oa_works_count":0,"cited_by_count":17},{"year":2016,"works_count":3,"oa_works_count":0,"cited_by_count":21},{"year":2017,"works_count":2,"oa_works_count":0,"cited_by_count":8},{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":9},{"year":2019,"works_count":4,"oa_works_count":0,"cited_by_count":22},{"year":2020,"works_count":1,"oa_works_count":0,"cited_by_count":16},{"year":2021,"works_count":1,"oa_works_count":0,"cited_by_count":16},{"year":2022,"works_count":4,"oa_works_count":2,"cited_by_count":24},{"year":2023,"works_count":7,"oa_works_count":5,"cited_by_count":25},{"year":2024,"works_count":8,"oa_works_count":5,"cited_by_count":35},{"year":2025,"works_count":3,"oa_works_count":2,"cited_by_count":35},{"year":2026,"works_count":5,"oa_works_count":1,"cited_by_count":33}],"display_name_alternatives":["T. Krivec","Thomas Krivec"],"block_key":"t krivec","works_api_url":"https://api.openalex.org/works?filter=author.id:A5036487496","updated_date":"2026-11-08T12:57:04","created_date":"2016-06-24T00:00:00"}