{"id":"https://openalex.org/A5035900182","orcid":null,"observed_orcids":[],"display_name":"Pao-Nan Lee","raw_author_names":["Pao-Nan Lee","Pao\u2010Nan Lee"],"full_name":"Pao-Nan Lee","works_count":19,"cited_by_count":137,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":5,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5035900182","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I142974352","ror":"https://ror.org/00mjawt10","display_name":"National Sun Yat-sen University","country_code":"TW","type":"education","lineage":["https://openalex.org/I142974352"]},"years":[2010]},{"institution":{"id":"https://openalex.org/I2799432993","ror":"https://ror.org/04rgfzt17","display_name":"Advanced Semiconductor Engineering (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]},"years":[2023,2022,2021,2020,2019,2018,2017,2016,2012,2011]}],"last_known_institutions":[{"id":"https://openalex.org/I2799432993","ror":"https://ror.org/04rgfzt17","display_name":"Advanced Semiconductor Engineering (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","count":13,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":11,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","count":9,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","count":4,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.00013,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":4.17e-05,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","value":3.3e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","value":3.22e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11249","display_name":"Wireless Power Transfer Systems","value":2.89e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.7599912881851196},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.6274174451828003},{"id":"24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","score":0.5787469744682312},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.4949912428855896},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.43602511286735535}],"counts_by_year":[{"year":2010,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":3,"oa_works_count":0,"cited_by_count":3},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2016,"works_count":1,"oa_works_count":0,"cited_by_count":8},{"year":2017,"works_count":3,"oa_works_count":0,"cited_by_count":7},{"year":2018,"works_count":2,"oa_works_count":0,"cited_by_count":8},{"year":2019,"works_count":2,"oa_works_count":0,"cited_by_count":7},{"year":2020,"works_count":2,"oa_works_count":0,"cited_by_count":14},{"year":2021,"works_count":1,"oa_works_count":0,"cited_by_count":11},{"year":2022,"works_count":2,"oa_works_count":0,"cited_by_count":14},{"year":2023,"works_count":1,"oa_works_count":0,"cited_by_count":20},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":2}],"display_name_alternatives":["Pao-Nan Lee","Pao\u2010Nan Lee"],"block_key":"p lee","works_api_url":"https://api.openalex.org/works?filter=author.id:A5035900182","updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}
