{"id":"https://openalex.org/A5035731117","orcid":null,"observed_orcids":[],"display_name":"Arthur Keigler","raw_author_names":["A. Keigler","A. L. Keigler","Arthur Keigler","Arthur L. Keigler"],"full_name":"Arthur L. Keigler","works_count":20,"cited_by_count":52,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":4,"i10_index":2},"ids":{"openalex":"https://openalex.org/A5035731117","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I114132059","ror":"https://ror.org/05gd76j39","display_name":"Tokyo Electron (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]},"years":[2017]},{"institution":{"id":"https://openalex.org/I63966007","ror":"https://ror.org/042nb2s44","display_name":"Massachusetts Institute of Technology","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]},"years":[1983]}],"last_known_institutions":[{"id":"https://openalex.org/I114132059","ror":"https://ror.org/05gd76j39","display_name":"Tokyo Electron (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I114132059"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":17,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","count":13,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":11,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":5,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.00013,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":9.64e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","value":7.29e-05,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14382","display_name":"Electrophoretic Deposition in Materials Science","value":7.01e-05,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":4.94e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8500169515609741},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.6633367538452148},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.5214447379112244},{"id":"171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","score":0.4702000021934509},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.38967061042785645}],"counts_by_year":[{"year":1983,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2006,"works_count":7,"oa_works_count":6,"cited_by_count":0},{"year":2007,"works_count":3,"oa_works_count":1,"cited_by_count":0},{"year":2010,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2011,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":1,"oa_works_count":1,"cited_by_count":5},{"year":2013,"works_count":1,"oa_works_count":0,"cited_by_count":2},{"year":2014,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":1},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":5}],"display_name_alternatives":["A. Keigler","A. L. Keigler","Arthur Keigler","Arthur L. Keigler"],"block_key":"a keigler","works_api_url":"https://api.openalex.org/works?filter=author.id:A5035731117","updated_date":"2026-11-08T12:57:04","created_date":"2016-06-24T00:00:00"}