{"id":"https://openalex.org/A5035016071","orcid":null,"observed_orcids":[],"display_name":"Tatsuhiko Asai","raw_author_names":["Tatsuhiko ASAI","Tatsuhiko Asai","\u6d45\u4e95\u7adc\u5f66"],"full_name":"Tatsuhiko Asai","works_count":23,"cited_by_count":55,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":4,"i10_index":1},"ids":{"openalex":"https://openalex.org/A5035016071","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I107139324","ror":"https://ror.org/03ss88z23","display_name":"Kagoshima University","country_code":"JP","type":"education","lineage":["https://openalex.org/I107139324"]},"years":[2018]},{"institution":{"id":"https://openalex.org/I161107111","ror":"https://ror.org/00khh5r84","display_name":"Tokyo Gakugei University","country_code":"JP","type":"education","lineage":["https://openalex.org/I161107111"]},"years":[2015]},{"institution":{"id":"https://openalex.org/I2799635668","ror":"https://ror.org/056701b75","display_name":"Fuji Electric (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I2799635668"]},"years":[2023,2018,2017,2016,2015,2014,2013,2008]},{"institution":{"id":"https://openalex.org/I4210086624","ror":"https://ror.org/002k06d85","display_name":"National Institute of Technology, Tokyo College","country_code":"JP","type":"education","lineage":["https://openalex.org/I4210086624","https://openalex.org/I4210120810"]},"years":[2015]},{"institution":{"id":"https://openalex.org/I4405275337","ror":"https://ror.org/03dvdyv56","display_name":"FUJI Electric Advanced Technology Co., Ltd. (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405275337"]},"years":[2008,2007,2005]}],"last_known_institutions":[{"id":"https://openalex.org/I2799635668","ror":"https://ror.org/056701b75","display_name":"Fuji Electric (Japan)","country_code":"JP","type":"company","lineage":["https://openalex.org/I2799635668"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":19,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","count":7,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","count":7,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11366","display_name":"Elasticity and Material Modeling","count":6,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","count":6,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.000108,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11366","display_name":"Elasticity and Material Modeling","value":3.7e-05,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","value":2.29e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","value":2.23e-05,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","value":1.67e-05,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","score":0.928754448890686},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8956136703491211},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.7356014251708984},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.27930277585983276},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.20856860280036926}],"counts_by_year":[{"year":2005,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2006,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2008,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2013,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2014,"works_count":4,"oa_works_count":2,"cited_by_count":2},{"year":2015,"works_count":2,"oa_works_count":1,"cited_by_count":6},{"year":2016,"works_count":4,"oa_works_count":4,"cited_by_count":3},{"year":2017,"works_count":2,"oa_works_count":2,"cited_by_count":2},{"year":2018,"works_count":1,"oa_works_count":1,"cited_by_count":3},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2023,"works_count":1,"oa_works_count":0,"cited_by_count":2},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":2}],"display_name_alternatives":["Tatsuhiko ASAI","Tatsuhiko Asai","\u6d45\u4e95\u7adc\u5f66"],"block_key":"t asai","works_api_url":"https://api.openalex.org/works?filter=author.id:A5035016071","updated_date":"2026-11-04T11:47:51","created_date":"2016-06-24T00:00:00"}