{"id":"https://openalex.org/A5032935322","orcid":null,"observed_orcids":[],"display_name":"Bryan Christian S. Bacquian","raw_author_names":["B. Bacquian","B. C. Bacquian","Bacquian, Bryan Christian S.","Bryan Christian Bacquian","Bryan Christian S. Bacquian"],"full_name":"Bacquian, Bryan Christian S.","works_count":58,"cited_by_count":45,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":4,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5032935322","orcid":null,"observed_orcids":[]},"affiliations":[],"last_known_institutions":null,"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":47,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":31,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","count":25,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","count":14,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","count":8,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0003664,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":0.0002664,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","value":0.0001101,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","value":7.76e-05,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","value":4.25e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","score":0.9329617619514465},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.7931501865386963},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.6031360626220703},{"id":"78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","score":0.5816925168037415},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.49782705307006836}],"counts_by_year":[{"year":2014,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2019,"works_count":31,"oa_works_count":30,"cited_by_count":2},{"year":2020,"works_count":23,"oa_works_count":23,"cited_by_count":13},{"year":2021,"works_count":3,"oa_works_count":3,"cited_by_count":13},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":1}],"display_name_alternatives":["B. Bacquian","B. C. Bacquian","Bacquian, Bryan Christian S.","Bryan Christian Bacquian","Bryan Christian S. Bacquian"],"block_key":"b bacquian","works_api_url":"https://api.openalex.org/works?filter=author.id:A5032935322","updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}