{"id":"https://openalex.org/A5032092089","orcid":"https://orcid.org/0000-0003-2269-2127","observed_orcids":["https://orcid.org/0000-0003-2269-2127"],"display_name":"Sven Dewilde","raw_author_names":["Dewilde, Sven","Sven Dewilde"],"full_name":"Sven Dewilde","works_count":24,"cited_by_count":341,"summary_stats":{"2yr_mean_citedness":6.384615384615385,"h_index":10,"i10_index":10},"ids":{"openalex":"https://openalex.org/A5032092089","orcid":"https://orcid.org/0000-0003-2269-2127","observed_orcids":["https://orcid.org/0000-0003-2269-2127"]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210114974","ror":"https://ror.org/02kcbn207","display_name":"IMEC","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},"years":[2026,2025,2024,2023,2022,2011]},{"institution":{"id":"https://openalex.org/I99464096","ror":"https://ror.org/05f950310","display_name":"KU Leuven","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]},"years":[2020,2017,2015,2014]}],"last_known_institutions":[{"id":"https://openalex.org/I4210114974","ror":"https://ror.org/02kcbn207","display_name":"IMEC","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":17,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":14,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":10,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10480","display_name":"Ionic liquids properties and applications","count":5,"subfield":{"id":"https://openalex.org/subfields/1606","display_name":"Physical and Theoretical Chemistry"},"field":{"id":"https://openalex.org/fields/16","display_name":"Chemistry"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10405","display_name":"Advanced Polymer Synthesis and Characterization","count":4,"subfield":{"id":"https://openalex.org/subfields/1605","display_name":"Organic Chemistry"},"field":{"id":"https://openalex.org/fields/16","display_name":"Chemistry"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0002003,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":9.86e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":7.89e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10480","display_name":"Ionic liquids properties and applications","value":4e-05,"subfield":{"id":"https://openalex.org/subfields/1606","display_name":"Physical and Theoretical Chemistry"},"field":{"id":"https://openalex.org/fields/16","display_name":"Chemistry"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12084","display_name":"Synthesis and properties of polymers","value":3.42e-05,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","score":0.8859668970108032},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.7773056030273438},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6120293140411377},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.4617678225040436},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.32899999618530273}],"counts_by_year":[{"year":2011,"works_count":2,"oa_works_count":2,"cited_by_count":0},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2014,"works_count":1,"oa_works_count":1,"cited_by_count":3},{"year":2015,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2017,"works_count":4,"oa_works_count":3,"cited_by_count":12},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":20},{"year":2020,"works_count":1,"oa_works_count":1,"cited_by_count":18},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":27},{"year":2022,"works_count":1,"oa_works_count":0,"cited_by_count":16},{"year":2023,"works_count":1,"oa_works_count":0,"cited_by_count":33},{"year":2024,"works_count":2,"oa_works_count":0,"cited_by_count":43},{"year":2025,"works_count":5,"oa_works_count":0,"cited_by_count":82},{"year":2026,"works_count":6,"oa_works_count":5,"cited_by_count":73}],"display_name_alternatives":["Dewilde, Sven","Sven Dewilde"],"block_key":"s dewilde","works_api_url":"https://api.openalex.org/works?filter=author.id:A5032092089","awards_count":1,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5032092089","updated_date":"2026-11-10T14:30:39","created_date":"2016-06-24T00:00:00"}