{"id":"https://openalex.org/A5031923082","orcid":null,"observed_orcids":[],"display_name":"Shoukun Huang","raw_author_names":["HUANG Shoukun","Shoukun Huang"],"full_name":"Shoukun Huang","works_count":6,"cited_by_count":12,"summary_stats":{"2yr_mean_citedness":3.0,"h_index":2,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5031923082","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I199305430","ror":"https://ror.org/02afcvw97","display_name":"Nantong University","country_code":"CN","type":"education","lineage":["https://openalex.org/I199305430"]},"years":[2018]},{"institution":{"id":"https://openalex.org/I41198531","ror":"https://ror.org/043bpky34","display_name":"Nanjing University of Posts and Telecommunications","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]},"years":[2025,2022]}],"last_known_institutions":[{"id":"https://openalex.org/I41198531","ror":"https://ror.org/043bpky34","display_name":"Nanjing University of Posts and Telecommunications","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]}],"topics":[{"id":"https://openalex.org/T11851","display_name":"Electromagnetic Compatibility and Measurements","count":3,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","count":2,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10069","display_name":"Antenna Design and Analysis","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11851","display_name":"Electromagnetic Compatibility and Measurements","value":1.96e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":1.13e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","value":1.02e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","value":9e-06,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11607","display_name":"Microwave and Dielectric Measurement Techniques","value":6.6e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.7017999291419983},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.601233720779419},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.4493107497692108},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.29440000653266907},{"id":"76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","score":0.22344309091567993}],"counts_by_year":[{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2021,"works_count":2,"oa_works_count":2,"cited_by_count":0},{"year":2022,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2025,"works_count":2,"oa_works_count":0,"cited_by_count":5},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":6}],"display_name_alternatives":["HUANG Shoukun","Shoukun Huang"],"block_key":"s huang","works_api_url":"https://api.openalex.org/works?filter=author.id:A5031923082","awards_count":0,"updated_date":"2026-11-04T11:47:51","created_date":"2018-10-26T00:00:00"}