{"id":"https://openalex.org/A5024364170","orcid":null,"observed_orcids":[],"display_name":"L.G. Feinstein","raw_author_names":["L. Feinstein","L. G. FEINSTEIN","L. G. Feinstein","L.G Feinstein","L.G. Feinstein","Louis Feinstein"],"full_name":"Feinstein,Lester","works_count":38,"cited_by_count":626,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":11,"i10_index":13},"ids":{"openalex":"https://openalex.org/A5024364170","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I1283103587","ror":"https://ror.org/02bbd5539","display_name":"AT&T (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I1283103587"]},"years":[1981,1980,1979,1973,1972,1971]},{"institution":{"id":"https://openalex.org/I1284022523","ror":"https://ror.org/003y2vw22","display_name":"Worcester Art Museum","country_code":"US","type":"archive","lineage":["https://openalex.org/I1284022523"]},"years":[2002]},{"institution":{"id":"https://openalex.org/I2799713793","ror":"https://ror.org/0132qa516","display_name":"Worcester Memorial Hospital","country_code":"US","type":"healthcare","lineage":["https://openalex.org/I2799713793"]},"years":[2002]},{"institution":{"id":"https://openalex.org/I4210124779","ror":"https://ror.org/027ka1x80","display_name":"National Aeronautics and Space Administration","country_code":"US","type":"government","lineage":["https://openalex.org/I4210124779"]},"years":[1970]},{"institution":{"id":"https://openalex.org/I44619346","ror":"https://ror.org/04h6azc67","display_name":"Textron (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I44619346"]},"years":[2010,2009]},{"institution":{"id":"https://openalex.org/I63966007","ror":"https://ror.org/042nb2s44","display_name":"Massachusetts Institute of Technology","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]},"years":[1970,1968,1965]}],"last_known_institutions":[{"id":"https://openalex.org/I44619346","ror":"https://ror.org/04h6azc67","display_name":"Textron (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I44619346"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":13,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":11,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13531","display_name":"Surface and Thin Film Phenomena","count":11,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","count":7,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12039","display_name":"Electron and X-Ray Spectroscopy Techniques","count":7,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T14014","display_name":"Transportation Systems and Infrastructure","value":0.0001245,"subfield":{"id":"https://openalex.org/subfields/1405","display_name":"Management of Technology and Innovation"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":0.0001086,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":7.37e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":4.73e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13531","display_name":"Surface and Thin Film Phenomena","value":4.28e-05,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8432160019874573},{"id":"185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","score":0.5484340190887451},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.5439068078994751},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.5139474272727966},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.5108904242515564}],"counts_by_year":[{"year":1965,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1968,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1969,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1970,"works_count":5,"oa_works_count":0,"cited_by_count":0},{"year":1971,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":1972,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":1973,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1974,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1975,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1977,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1979,"works_count":5,"oa_works_count":0,"cited_by_count":0},{"year":1980,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1981,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":1982,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1983,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1987,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1989,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1999,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2002,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2009,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":15},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":9}],"display_name_alternatives":["L. Feinstein","L. G. FEINSTEIN","L. G. Feinstein","L.G Feinstein","L.G. Feinstein","Louis Feinstein"],"block_key":"l feinstein","works_api_url":"https://api.openalex.org/works?filter=author.id:A5024364170","updated_date":"2026-11-08T12:57:04","created_date":"2016-06-24T00:00:00"}