{"id":"https://openalex.org/A5023498593","orcid":"https://orcid.org/0000-0003-1383-5325","observed_orcids":["https://orcid.org/0000-0003-1383-5325"],"display_name":"Gurijala Deepthi","raw_author_names":["Gurijala Deepthi"],"full_name":"G. Meghana Deepthi","works_count":4,"cited_by_count":21,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":3,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5023498593","orcid":"https://orcid.org/0000-0003-1383-5325","observed_orcids":["https://orcid.org/0000-0003-1383-5325"]},"affiliations":[{"institution":{"id":"https://openalex.org/I885392262","ror":"https://ror.org/0440p1d37","display_name":"GITAM University","country_code":"IN","type":"education","lineage":["https://openalex.org/I885392262"]},"years":[2023,2022,2021]}],"last_known_institutions":[{"id":"https://openalex.org/I885392262","ror":"https://ror.org/0440p1d37","display_name":"GITAM University","country_code":"IN","type":"education","lineage":["https://openalex.org/I885392262"]}],"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":4,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","count":2,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","count":2,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":3.96e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","value":1.36e-05,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":1.19e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11263","display_name":"Electromagnetic Simulation and Numerical Methods","value":7e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","value":6.4e-06,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8621349334716797},{"id":"123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","score":0.817376971244812},{"id":"24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","score":0.560985803604126},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.46895140409469604},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.20046690106391907}],"counts_by_year":[{"year":2021,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2022,"works_count":2,"oa_works_count":1,"cited_by_count":5},{"year":2023,"works_count":1,"oa_works_count":0,"cited_by_count":7},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":1}],"display_name_alternatives":["Gurijala Deepthi"],"block_key":"g deepthi","works_api_url":"https://api.openalex.org/works?filter=author.id:A5023498593","awards_count":0,"updated_date":"2026-10-27T12:30:23","created_date":"2021-10-25T00:00:00"}