{"id":"https://openalex.org/A5020255264","orcid":null,"observed_orcids":[],"display_name":"M.-P. Samson","raw_author_names":["M-P. Samson","M. -P. Samson","M. P. Samson","M.-P. Samson","M.P. Samson","MP. Samson"],"full_name":"Melanie Samson","works_count":18,"cited_by_count":615,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":10,"i10_index":10},"ids":{"openalex":"https://openalex.org/A5020255264","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I2738703131","ror":"https://ror.org/00jjx8s55","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},"years":[2017,2016,2014,2012]},{"institution":{"id":"https://openalex.org/I3020098449","ror":"https://ror.org/02mg6n827","display_name":"CEA Grenoble","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},"years":[2017,2014,2012]},{"institution":{"id":"https://openalex.org/I4210104693","ror":"https://ror.org/01c74sd89","display_name":"STMicroelectronics (France)","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]},"years":[2017,2016,2014,2005]},{"institution":{"id":"https://openalex.org/I4210150049","ror":"https://ror.org/04mf0wv34","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},"years":[2017,2014,2012]},{"institution":{"id":"https://openalex.org/I899635006","ror":"https://ror.org/02rx3b187","display_name":"Universit\u00e9 Grenoble Alpes","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]},"years":[2017,2014]}],"last_known_institutions":[{"id":"https://openalex.org/I2738703131","ror":"https://ror.org/00jjx8s55","display_name":"Commissariat \u00e0 l'\u00c9nergie Atomique et aux \u00c9nergies Alternatives","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131"]},{"id":"https://openalex.org/I3020098449","ror":"https://ror.org/02mg6n827","display_name":"CEA Grenoble","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I3020098449"]},{"id":"https://openalex.org/I4210104693","ror":"https://ror.org/01c74sd89","display_name":"STMicroelectronics (France)","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]},{"id":"https://openalex.org/I4210150049","ror":"https://ror.org/04mf0wv34","display_name":"Laboratoire d'\u00c9lectronique des Technologies de l'Information","country_code":"FR","type":"government","lineage":["https://openalex.org/I2738703131","https://openalex.org/I4210117989","https://openalex.org/I4210150049"]},{"id":"https://openalex.org/I899635006","ror":"https://ror.org/02rx3b187","display_name":"Universit\u00e9 Grenoble Alpes","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":17,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":13,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","count":11,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":6,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","count":2,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0001536,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":5.92e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","value":4.08e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","value":3.52e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12420","display_name":"Silicone and Siloxane Chemistry","value":1.21e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8458656072616577},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.7030428051948547},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6521419286727905},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.45013394951820374},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.2886243462562561}],"counts_by_year":[{"year":2005,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":1,"oa_works_count":1,"cited_by_count":2},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":18},{"year":2014,"works_count":3,"oa_works_count":1,"cited_by_count":30},{"year":2015,"works_count":2,"oa_works_count":0,"cited_by_count":40},{"year":2016,"works_count":5,"oa_works_count":0,"cited_by_count":44},{"year":2017,"works_count":5,"oa_works_count":0,"cited_by_count":54},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":56},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":68},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":36},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":77},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":41},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":50},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":40},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":32},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":16}],"display_name_alternatives":["M-P. Samson","M. -P. Samson","M. P. Samson","M.-P. Samson","M.P. Samson","MP. Samson"],"block_key":"m samson","works_api_url":"https://api.openalex.org/works?filter=author.id:A5020255264","awards_count":0,"updated_date":"2026-11-08T12:57:04","created_date":"2016-06-24T00:00:00"}