{"id":"https://openalex.org/A5019134208","orcid":"https://orcid.org/0000-0003-1707-7138","observed_orcids":["https://orcid.org/0000-0003-1707-7138"],"display_name":"Hung\u2010Chun Kuo","raw_author_names":["H. C. Kuo","Hung-Chun Kuo","Hung-chun Kuo","Hung\u2010Chun Kuo"],"full_name":"Hung-Chun Kuo","works_count":45,"cited_by_count":238,"summary_stats":{"2yr_mean_citedness":2.25,"h_index":7,"i10_index":7},"ids":{"openalex":"https://openalex.org/A5019134208","orcid":"https://orcid.org/0000-0003-1707-7138","observed_orcids":["https://orcid.org/0000-0003-1707-7138"]},"affiliations":[{"institution":{"id":"https://openalex.org/I142974352","ror":"https://ror.org/00mjawt10","display_name":"National Sun Yat-sen University","country_code":"TW","type":"education","lineage":["https://openalex.org/I142974352"]},"years":[2023,2022,2018,2016,2006]},{"institution":{"id":"https://openalex.org/I2799432993","ror":"https://ror.org/04rgfzt17","display_name":"Advanced Semiconductor Engineering (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]},"years":[2026,2025,2024,2023,2022,2021,2020,2019,2018,2017,2016,2015,2014]}],"last_known_institutions":[{"id":"https://openalex.org/I2799432993","ror":"https://ror.org/04rgfzt17","display_name":"Advanced Semiconductor Engineering (Taiwan)","country_code":"TW","type":"company","lineage":["https://openalex.org/I2799432993"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":23,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","count":19,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":16,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","count":15,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","count":15,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0002718,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","value":0.0001021,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":9.07e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","value":7.62e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","value":4.82e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.829413890838623},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.6647590398788452},{"id":"24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","score":0.568205714225769},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.4792309105396271},{"id":"119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","score":0.47296661138534546}],"counts_by_year":[{"year":2006,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2014,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2015,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2016,"works_count":5,"oa_works_count":0,"cited_by_count":1},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":2},{"year":2018,"works_count":5,"oa_works_count":0,"cited_by_count":6},{"year":2019,"works_count":4,"oa_works_count":0,"cited_by_count":6},{"year":2020,"works_count":1,"oa_works_count":0,"cited_by_count":14},{"year":2021,"works_count":4,"oa_works_count":0,"cited_by_count":18},{"year":2022,"works_count":5,"oa_works_count":0,"cited_by_count":26},{"year":2023,"works_count":6,"oa_works_count":0,"cited_by_count":46},{"year":2024,"works_count":4,"oa_works_count":0,"cited_by_count":44},{"year":2025,"works_count":3,"oa_works_count":0,"cited_by_count":46},{"year":2026,"works_count":1,"oa_works_count":0,"cited_by_count":28}],"display_name_alternatives":["H. C. Kuo","Hung-Chun Kuo","Hung-chun Kuo","Hung\u2010Chun Kuo"],"block_key":"h kuo","works_api_url":"https://api.openalex.org/works?filter=author.id:A5019134208","updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}