{"id":"https://openalex.org/A5018090775","orcid":null,"observed_orcids":[],"display_name":"L. Chekour","raw_author_names":["CHEKOUR, L.","Chekour, L.","Chekour, Lounis","L CHEKOUR","L. CHEKOUR, L. CHEKOUR","L. Chekour","Lounis Chekour"],"full_name":"CHEKOUR, Lounis","works_count":26,"cited_by_count":103,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":6,"i10_index":4},"ids":{"openalex":"https://openalex.org/A5018090775","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I125485651","ror":"https://ror.org/017wv6808","display_name":"University Fr\u00e8res Mentouri Constantine 1","country_code":"DZ","type":"education","lineage":["https://openalex.org/I125485651"]},"years":[2018,2017,2016,2014,2013,2012,2011,2009,2008,2007,2005,2004]}],"last_known_institutions":[{"id":"https://openalex.org/I125485651","ror":"https://ror.org/017wv6808","display_name":"University Fr\u00e8res Mentouri Constantine 1","country_code":"DZ","type":"education","lineage":["https://openalex.org/I125485651"]}],"topics":[{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","count":22,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13470","display_name":"Surface Treatment and Coatings","count":20,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":7,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12106","display_name":"Surface Treatment and Residual Stress","count":7,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13889","display_name":"Advanced Materials and Semiconductor Technologies","count":6,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","value":9.85e-05,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":6.64e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12106","display_name":"Surface Treatment and Residual Stress","value":5.35e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13470","display_name":"Surface Treatment and Coatings","value":4.98e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13889","display_name":"Advanced Materials and Semiconductor Technologies","value":4.31e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9132364988327026},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.7632956504821777},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.7518398761749268},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.4872268736362457},{"id":"2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","score":0.42421725392341614}],"counts_by_year":[{"year":1996,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2003,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2004,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2005,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2007,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2008,"works_count":3,"oa_works_count":3,"cited_by_count":0},{"year":2009,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":2,"oa_works_count":2,"cited_by_count":6},{"year":2013,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2014,"works_count":2,"oa_works_count":2,"cited_by_count":4},{"year":2015,"works_count":1,"oa_works_count":0,"cited_by_count":7},{"year":2016,"works_count":3,"oa_works_count":1,"cited_by_count":6},{"year":2017,"works_count":1,"oa_works_count":1,"cited_by_count":4},{"year":2018,"works_count":2,"oa_works_count":1,"cited_by_count":2},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":3}],"display_name_alternatives":["CHEKOUR, L.","Chekour, L.","Chekour, Lounis","L CHEKOUR","L. CHEKOUR, L. CHEKOUR","L. Chekour","Lounis Chekour"],"block_key":"l chekour","works_api_url":"https://api.openalex.org/works?filter=author.id:A5018090775","updated_date":"2026-10-29T12:27:34","created_date":"2025-10-10T00:00:00"}