{"id":"https://openalex.org/A5016961561","orcid":"https://orcid.org/0000-0003-4107-2126","observed_orcids":["https://orcid.org/0000-0003-4107-2126"],"display_name":"Sukeshwar Kannan","raw_author_names":["S. Kannan","Sukesh Kannan","Sukeshwar Kannan"],"full_name":"Kannan, Sukeshwar","works_count":55,"cited_by_count":535,"summary_stats":{"2yr_mean_citedness":26.0,"h_index":14,"i10_index":20},"ids":{"openalex":"https://openalex.org/A5016961561","orcid":"https://orcid.org/0000-0003-4107-2126","observed_orcids":["https://orcid.org/0000-0003-4107-2126"]},"affiliations":[{"institution":{"id":"https://openalex.org/I17301866","ror":"https://ror.org/03xrrjk67","display_name":"University of Alabama","country_code":"US","type":"education","lineage":["https://openalex.org/I17301866"]},"years":[2013,2012,2011,2010,2009]},{"institution":{"id":"https://openalex.org/I35662394","ror":"https://ror.org/02h0ps145","display_name":"GlobalFoundries (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]},"years":[2018,2017,2016,2015,2014,2013]},{"institution":{"id":"https://openalex.org/I4210099316","ror":"https://ror.org/018extf73","display_name":"Lightmatter (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210099316"]},"years":[2020,2019]},{"institution":{"id":"https://openalex.org/I4210127325","ror":"https://ror.org/035gt5s03","display_name":"Broadcom (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127325"]},"years":[2024,2023,2021]}],"last_known_institutions":[{"id":"https://openalex.org/I4210127325","ror":"https://ror.org/035gt5s03","display_name":"Broadcom (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127325"]}],"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":41,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","count":34,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","count":12,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":10,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","count":9,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0004845,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","value":0.0003548,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","value":0.0001699,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":9.87e-05,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","value":6.12e-05,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8686766624450684},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.7196861505508423},{"id":"24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","score":0.621652364730835},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6075408458709717},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.5230618119239807}],"counts_by_year":[{"year":2009,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":7,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":8,"oa_works_count":1,"cited_by_count":22},{"year":2013,"works_count":6,"oa_works_count":1,"cited_by_count":15},{"year":2014,"works_count":3,"oa_works_count":1,"cited_by_count":33},{"year":2015,"works_count":3,"oa_works_count":0,"cited_by_count":25},{"year":2016,"works_count":9,"oa_works_count":0,"cited_by_count":28},{"year":2017,"works_count":5,"oa_works_count":0,"cited_by_count":33},{"year":2018,"works_count":3,"oa_works_count":0,"cited_by_count":36},{"year":2019,"works_count":1,"oa_works_count":0,"cited_by_count":46},{"year":2020,"works_count":1,"oa_works_count":0,"cited_by_count":27},{"year":2021,"works_count":1,"oa_works_count":0,"cited_by_count":29},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":31},{"year":2023,"works_count":2,"oa_works_count":1,"cited_by_count":36},{"year":2024,"works_count":1,"oa_works_count":0,"cited_by_count":56},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":68},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":20}],"display_name_alternatives":["S. Kannan","Sukesh Kannan","Sukeshwar Kannan"],"block_key":"s kannan","works_api_url":"https://api.openalex.org/works?filter=author.id:A5016961561","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}