{"id":"https://openalex.org/A5012000813","orcid":null,"observed_orcids":[],"display_name":"Leonardus H. A. Leunissen","raw_author_names":["L LEUNISSEN","L. H. A. Leunissen","L. H. Leunissen","L. Leunissen","L.H.A. Leunissen","Leonardus A. H. Leunissen","Leonardus H. A. Leunissen","Leonardus H. Leunissen","Leonardus H.A. Leunissen","Leonardus Leunissen"],"full_name":"Leonardus H. A. Leunissen","works_count":70,"cited_by_count":878,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":17,"i10_index":28},"ids":{"openalex":"https://openalex.org/A5012000813","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210107087","ror":"https://ror.org/01q8f6705","display_name":"BASF (Germany)","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210107087"]},"years":[2015,2014]},{"institution":{"id":"https://openalex.org/I4210114974","ror":"https://ror.org/02kcbn207","display_name":"IMEC","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},"years":[2013,2012,2011,2010,2009,2007,2006,2005,2004,2003]},{"institution":{"id":"https://openalex.org/I4210142027","ror":"https://ror.org/045jad561","display_name":"GlobalFoundries (Germany)","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]},"years":[2013]}],"last_known_institutions":null,"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","count":42,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","count":22,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":20,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":18,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11517","display_name":"Advanced optical system design","count":15,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","value":0.0003887,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":0.0001777,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","value":0.0001731,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":8.27e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12092","display_name":"Erosion and Abrasive Machining","value":8.01e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8828761577606201},{"id":"49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","score":0.6387380361557007},{"id":"171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","score":0.5028602480888367},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.46659043431282043},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.45540672540664673}],"counts_by_year":[{"year":2003,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2004,"works_count":8,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":9,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":13,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":11,"oa_works_count":8,"cited_by_count":0},{"year":2009,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2011,"works_count":4,"oa_works_count":3,"cited_by_count":0},{"year":2012,"works_count":8,"oa_works_count":3,"cited_by_count":69},{"year":2013,"works_count":3,"oa_works_count":0,"cited_by_count":50},{"year":2014,"works_count":3,"oa_works_count":0,"cited_by_count":42},{"year":2015,"works_count":4,"oa_works_count":0,"cited_by_count":47},{"year":2016,"works_count":1,"oa_works_count":0,"cited_by_count":48},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":33},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":36},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":42},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":19},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":27},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":22},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":27},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":21},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":53},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":34}],"display_name_alternatives":["L LEUNISSEN","L. H. A. Leunissen","L. H. Leunissen","L. Leunissen","L.H.A. Leunissen","Leonardus A. H. Leunissen","Leonardus H. A. Leunissen","Leonardus H. Leunissen","Leonardus H.A. Leunissen","Leonardus Leunissen"],"block_key":"l leunissen","works_api_url":"https://api.openalex.org/works?filter=author.id:A5012000813","updated_date":"2026-11-08T12:57:04","created_date":"2016-06-24T00:00:00"}