{"id":"https://openalex.org/A5011672408","orcid":null,"observed_orcids":[],"display_name":"Thomas Zahner","raw_author_names":["T. Zahner","Thomas Zahner"],"full_name":"Zahner, Thomas","works_count":25,"cited_by_count":466,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":10,"i10_index":11},"ids":{"openalex":"https://openalex.org/A5011672408","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I4387154934","ror":"https://ror.org/05v6nhz77","display_name":"Osram Opto Semiconductors","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210103613","https://openalex.org/I4387154934"]},"years":[2018,2017,2016,2015,2014,2013,2007,2006,2004]}],"last_known_institutions":[{"id":"https://openalex.org/I4387154934","ror":"https://ror.org/05v6nhz77","display_name":"Osram Opto Semiconductors","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210103613","https://openalex.org/I4387154934"]}],"topics":[{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","count":17,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","count":14,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","count":13,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":10,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":4,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","value":8.44e-05,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","value":7.31e-05,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","value":6.41e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":5.67e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","value":5.66e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9388612508773804},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.8510947823524475},{"id":"204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","score":0.6041284203529358},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.44732826948165894},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.29446378350257874}],"counts_by_year":[{"year":2004,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":10},{"year":2013,"works_count":3,"oa_works_count":1,"cited_by_count":9},{"year":2014,"works_count":6,"oa_works_count":0,"cited_by_count":9},{"year":2015,"works_count":1,"oa_works_count":0,"cited_by_count":17},{"year":2016,"works_count":3,"oa_works_count":0,"cited_by_count":20},{"year":2017,"works_count":5,"oa_works_count":0,"cited_by_count":34},{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":40},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":40},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":60},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":39},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":31},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":26},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":25},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":33},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":28}],"display_name_alternatives":["T. Zahner","Thomas Zahner"],"block_key":"t zahner","works_api_url":"https://api.openalex.org/works?filter=author.id:A5011672408","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}