{"id":"https://openalex.org/A5010850053","orcid":"https://orcid.org/0009-0000-2972-8845","observed_orcids":["https://orcid.org/0009-0000-2972-8845"],"display_name":"Tzu-I Ho","raw_author_names":["Ho, Tzu-I","Tzu-I Ho"],"full_name":"Tzu-I Ho","works_count":3,"cited_by_count":9,"summary_stats":{"2yr_mean_citedness":0.5,"h_index":1,"i10_index":0},"ids":{"openalex":"https://openalex.org/A5010850053","orcid":"https://orcid.org/0009-0000-2972-8845","observed_orcids":["https://orcid.org/0009-0000-2972-8845"]},"affiliations":[{"institution":{"id":"https://openalex.org/I151746483","ror":"https://ror.org/01aff2v68","display_name":"University of Waterloo","country_code":"CA","type":"education","lineage":["https://openalex.org/I151746483"]},"years":[2026]}],"last_known_institutions":[{"id":"https://openalex.org/I151746483","ror":"https://ror.org/01aff2v68","display_name":"University of Waterloo","country_code":"CA","type":"education","lineage":["https://openalex.org/I151746483"]}],"topics":[{"id":"https://openalex.org/T10028","display_name":"Topic Modeling","count":2,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10286","display_name":"Information Retrieval and Search Behavior","count":2,"subfield":{"id":"https://openalex.org/subfields/1710","display_name":"Information Systems"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10181","display_name":"Natural Language Processing Techniques","count":1,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10215","display_name":"Semantic Web and Ontologies","count":1,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","count":1,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T10286","display_name":"Information Retrieval and Search Behavior","value":5.8e-06,"subfield":{"id":"https://openalex.org/subfields/1710","display_name":"Information Systems"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":5.7e-06,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","value":5.6e-06,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","value":4.7e-06,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10028","display_name":"Topic Modeling","value":4e-06,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"23123220","wikidata":"https://www.wikidata.org/wiki/Q816826","display_name":"Information retrieval","score":0.588100016117096},{"id":"154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","score":0.5805000066757202},{"id":"2776321320","wikidata":"https://www.wikidata.org/wiki/Q857525","display_name":"Annotation","score":0.4433000087738037},{"id":"124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","score":0.39410001039505005},{"id":"119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","score":0.352400004863739}],"counts_by_year":[{"year":2014,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2026,"works_count":2,"oa_works_count":2,"cited_by_count":1}],"display_name_alternatives":["Ho, Tzu-I","Tzu-I Ho"],"block_key":"t ho","works_api_url":"https://api.openalex.org/works?filter=author.id:A5010850053","awards_count":0,"updated_date":"2026-11-01T11:00:13","created_date":"2016-06-24T00:00:00"}