{"id":"https://openalex.org/A5007203546","orcid":null,"observed_orcids":[],"display_name":"Peter Zimprich","raw_author_names":["P Zimprich","P. Zimprich","Peter Zimprich"],"full_name":"Peter Zimprich","works_count":19,"cited_by_count":263,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":6,"i10_index":6},"ids":{"openalex":"https://openalex.org/A5007203546","orcid":null,"observed_orcids":[]},"affiliations":[{"institution":{"id":"https://openalex.org/I129774422","ror":"https://ror.org/03prydq77","display_name":"University of Vienna","country_code":"AT","type":"education","lineage":["https://openalex.org/I129774422"]},"years":[2008,2007,2006,2004,2003,2002,2000,1996]}],"last_known_institutions":[{"id":"https://openalex.org/I129774422","ror":"https://ror.org/03prydq77","display_name":"University of Vienna","country_code":"AT","type":"education","lineage":["https://openalex.org/I129774422"]}],"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":8,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10638","display_name":"Optical measurement and interference techniques","count":8,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","count":7,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13312","display_name":"Mechanical and Thermal Properties Analysis","count":7,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":4,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T13312","display_name":"Mechanical and Thermal Properties Analysis","value":8.25e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":4.53e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","value":3.28e-05,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10638","display_name":"Optical measurement and interference techniques","value":2.68e-05,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12468","display_name":"Radiation Effects and Dosimetry","value":2.27e-05,"subfield":{"id":"https://openalex.org/subfields/1106","display_name":"Food Science"},"field":{"id":"https://openalex.org/fields/11","display_name":"Agricultural and Biological Sciences"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.8806263208389282},{"id":"120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","score":0.7599037885665894},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.6212875843048096},{"id":"191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","score":0.5165740251541138},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.4520086348056793}],"counts_by_year":[{"year":1996,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2000,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2002,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":3,"oa_works_count":2,"cited_by_count":0},{"year":2004,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2005,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":4,"oa_works_count":0,"cited_by_count":0},{"year":2007,"works_count":3,"oa_works_count":2,"cited_by_count":0},{"year":2008,"works_count":3,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":29},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":17},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":21},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":21},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":20},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":6},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":5},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":9},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":12},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":15},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":4}],"display_name_alternatives":["P Zimprich","P. Zimprich","Peter Zimprich"],"block_key":"p zimprich","works_api_url":"https://api.openalex.org/works?filter=author.id:A5007203546","awards_count":0,"updated_date":"2026-11-07T12:08:38","created_date":"2016-06-24T00:00:00"}