{"id":"https://openalex.org/A5005259128","orcid":"https://orcid.org/0000-0002-9534-7060","observed_orcids":["https://orcid.org/0000-0002-9534-7060"],"display_name":"Matthias Kraatz","raw_author_names":["Kraatz, Matthias","M. Kraatz","Matthias Kraatz"],"full_name":"Matthias Kraatz","works_count":25,"cited_by_count":186,"summary_stats":{"2yr_mean_citedness":1.0,"h_index":7,"i10_index":5},"ids":{"openalex":"https://openalex.org/A5005259128","orcid":"https://orcid.org/0000-0002-9534-7060","observed_orcids":["https://orcid.org/0000-0002-9534-7060"]},"affiliations":[{"institution":{"id":"https://openalex.org/I4210134618","ror":"https://ror.org/03wq67h32","display_name":"Fraunhofer Institute for Nondestructive Testing","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134618","https://openalex.org/I4923324"]},"years":[2010]},{"institution":{"id":"https://openalex.org/I4210142027","ror":"https://ror.org/045jad561","display_name":"GlobalFoundries (Germany)","country_code":"DE","type":"company","lineage":["https://openalex.org/I35662394","https://openalex.org/I4210142027"]},"years":[2010]},{"institution":{"id":"https://openalex.org/I4210145959","ror":"https://ror.org/0448sak71","display_name":"Fraunhofer Institute for Ceramic Technologies and Systems","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210145959","https://openalex.org/I4923324"]},"years":[2024,2023,2022,2021,2018,2016]},{"institution":{"id":"https://openalex.org/I51783024","ror":"https://ror.org/02wxx3e24","display_name":"Brandenburg University of Technology Cottbus-Senftenberg","country_code":"DE","type":"education","lineage":["https://openalex.org/I51783024"]},"years":[2009,2003]},{"institution":{"id":"https://openalex.org/I74973139","ror":"https://ror.org/05x2bcf33","display_name":"Carnegie Mellon University","country_code":"US","type":"education","lineage":["https://openalex.org/I74973139"]},"years":[1998]},{"institution":{"id":"https://openalex.org/I86519309","ror":"https://ror.org/00hj54h04","display_name":"The University of Texas at Austin","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]},"years":[2010,2009,2008,2006,2005]}],"last_known_institutions":[{"id":"https://openalex.org/I4210145959","ror":"https://ror.org/0448sak71","display_name":"Fraunhofer Institute for Ceramic Technologies and Systems","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210145959","https://openalex.org/I4923324"]}],"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","count":18,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","count":14,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":12,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","count":6,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","count":5,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","value":0.0001775,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":0.0001413,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","value":7.89e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","value":7.06e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","value":2.18e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.9086755514144897},{"id":"159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","score":0.5195146799087524},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.4230308532714844},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.3378942608833313},{"id":"121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","score":0.19303178787231445}],"counts_by_year":[{"year":1998,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2002,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2003,"works_count":2,"oa_works_count":1,"cited_by_count":0},{"year":2005,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2006,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2008,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2009,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2010,"works_count":3,"oa_works_count":1,"cited_by_count":0},{"year":2011,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":7},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2016,"works_count":1,"oa_works_count":0,"cited_by_count":2},{"year":2017,"works_count":1,"oa_works_count":0,"cited_by_count":9},{"year":2018,"works_count":1,"oa_works_count":0,"cited_by_count":5},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":3},{"year":2021,"works_count":1,"oa_works_count":0,"cited_by_count":4},{"year":2022,"works_count":1,"oa_works_count":1,"cited_by_count":4},{"year":2023,"works_count":2,"oa_works_count":2,"cited_by_count":17},{"year":2024,"works_count":4,"oa_works_count":1,"cited_by_count":23},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":25},{"year":2026,"works_count":0,"oa_works_count":0,"cited_by_count":7}],"display_name_alternatives":["Kraatz, Matthias","M. Kraatz","Matthias Kraatz"],"block_key":"m kraatz","works_api_url":"https://api.openalex.org/works?filter=author.id:A5005259128","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5005259128","updated_date":"2026-11-14T11:48:19","created_date":"2016-06-24T00:00:00"}