{"id":"https://openalex.org/A5000483077","orcid":null,"observed_orcids":[],"display_name":"James Verzosa","raw_author_names":["James Verzosa"],"full_name":"James Verzosa","works_count":1,"cited_by_count":17,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":1,"i10_index":1},"ids":{"openalex":"https://openalex.org/A5000483077","orcid":null,"observed_orcids":[]},"affiliations":[],"last_known_institutions":null,"topics":[{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","count":1,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","count":1,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","count":1,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"topic_share":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","value":1.19e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","value":7.9e-06,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","value":2.9e-06,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","score":0.9034148454666138},{"id":"162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","score":0.8823409676551819},{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.5620692372322083},{"id":"24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","score":0.3292061686515808},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.23628604412078857}],"counts_by_year":[{"year":2009,"works_count":1,"oa_works_count":1,"cited_by_count":0},{"year":2012,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2013,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2014,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2015,"works_count":0,"oa_works_count":0,"cited_by_count":2},{"year":2017,"works_count":0,"oa_works_count":0,"cited_by_count":1},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":3}],"display_name_alternatives":["James Verzosa"],"block_key":"j verzosa","works_api_url":"https://api.openalex.org/works?filter=author.id:A5000483077","awards_count":0,"updated_date":"2026-10-27T12:30:23","created_date":"2016-06-24T00:00:00"}